TY - GEN
T1 - Integrated magnetics on silicon for power supply in package (PSiP) and power supply on chip (PwrSoC)
AU - Wang, Ningning
AU - Hannon, Jason
AU - Foley, Ray
AU - McCarthy, Kevin
AU - O'Donnell, Terence
AU - Rodgers, Kenneth
AU - Waldron, Finbarr
AU - Ó Mathúna, Cian
PY - 2010
Y1 - 2010
N2 - The paper introduces the context for the emerging area of integrated power conversion. The key applications driving this trend are outlined and the principal competing technologies are presented encompassing system in package, system on chip and embedded substrate solutions. A system-in-package, 30MHz dc-dc converter using a stacked co-packaging approach is demonstrated. Its enabling key elements, including magnetics on Si technology, a power IC with a digital pulse width modulator and on-chip capacitor, and associated packaging techniques are also presented. A maximum measured efficiency of 71.7% is achieved on the stacked converter with a 30% area reduction compared to side-by-side implementation.
AB - The paper introduces the context for the emerging area of integrated power conversion. The key applications driving this trend are outlined and the principal competing technologies are presented encompassing system in package, system on chip and embedded substrate solutions. A system-in-package, 30MHz dc-dc converter using a stacked co-packaging approach is demonstrated. Its enabling key elements, including magnetics on Si technology, a power IC with a digital pulse width modulator and on-chip capacitor, and associated packaging techniques are also presented. A maximum measured efficiency of 71.7% is achieved on the stacked converter with a 30% area reduction compared to side-by-side implementation.
UR - https://www.scopus.com/pages/publications/78651298851
U2 - 10.1109/ESTC.2010.5642892
DO - 10.1109/ESTC.2010.5642892
M3 - Conference proceeding
AN - SCOPUS:78651298851
SN - 9781424485536
T3 - Electronics System Integration Technology Conference, ESTC 2010 - Proceedings
BT - Electronics System Integration Technology Conference, ESTC 2010 - Proceedings
T2 - 3rd Electronics System Integration Technology Conference, ESTC 2010
Y2 - 13 September 2010 through 16 September 2010
ER -