Integrated passives in advanced printed wiring boards

Engineering

• Realization 100%
• Printed Circuit Board 100%
• Electroless Plating 50%
• Magnetic Core 50%
• Manufacturing Process 50%
• Test Structure 50%
• Resistive 50%
• High Dielectric Constant 50%
• Passive Component 50%
• Capacitance Per Unit Area 50%

Material Science

• Capacitor 100%
• Electroless Deposition 50%
• Magnetic Core 50%
• Capacitance 50%
• Permittivity 50%
• Magnetic Material 50%