Integrated Photonics Packaging: Challenges and Opportunities

Luigi Ranno; Parnika Gupta; Kamil Gradkowski; Robert Bernson; Drew Weninger; Samuel Serna; Anuradha Murthy Agarwal; Lionel C. Kimerling; Juejun Hu; Peter Obrien

doi:10.1021/acsphotonics.2c00891

Integrated Photonics Packaging: Challenges and Opportunities

Luigi Ranno
, Parnika Gupta
, Kamil Gradkowski
, Robert Bernson
, Drew Weninger
, Samuel Serna
, Anuradha Murthy Agarwal
, Lionel C. Kimerling
, Juejun Hu
, Peter Obrien

Massachusetts Institute of Technology
University College Cork
Bridgewater State University

Research output: Contribution to journal › Review article › peer-review

Abstract

Packaging of photonic integrated circuit (PIC) chips is an essential and critical step before they can be integrated into functional optoelectronic systems. Photonic packaging is however often a major barrier impeding scalable deployment of PIC technologies given its high cost and limited throughput. This perspective addresses the technical challenges and discusses promising strategies and research directions to overcome the "packaging bottleneck".

Original language	English
Pages (from-to)	3467-3485
Number of pages	19
Journal	ACS Photonics
Volume	9
Issue number	11
DOIs	https://doi.org/10.1021/acsphotonics.2c00891
Publication status	Published - 16 Nov 2022

Keywords

Laser integration
Optical coupling
Optoelectronics
Photonic integrated circuits
Photonic packaging
Thermal management

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10.1021/acsphotonics.2c00891

Cite this

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abstract = "Packaging of photonic integrated circuit (PIC) chips is an essential and critical step before they can be integrated into functional optoelectronic systems. Photonic packaging is however often a major barrier impeding scalable deployment of PIC technologies given its high cost and limited throughput. This perspective addresses the technical challenges and discusses promising strategies and research directions to overcome the {"}packaging bottleneck{"}.",

keywords = "Laser integration, Optical coupling, Optoelectronics, Photonic integrated circuits, Photonic packaging, Thermal management",

author = "Luigi Ranno and Parnika Gupta and Kamil Gradkowski and Robert Bernson and Drew Weninger and Samuel Serna and Agarwal, \{Anuradha Murthy\} and Kimerling, \{Lionel C.\} and Juejun Hu and Peter Obrien",

year = "2022",

month = nov,

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doi = "10.1021/acsphotonics.2c00891",

language = "English",

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journal = "ACS Photonics",

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TY - JOUR

T1 - Integrated Photonics Packaging

T2 - Challenges and Opportunities

AU - Ranno, Luigi

AU - Gupta, Parnika

AU - Gradkowski, Kamil

AU - Bernson, Robert

AU - Weninger, Drew

AU - Serna, Samuel

AU - Agarwal, Anuradha Murthy

AU - Kimerling, Lionel C.

AU - Hu, Juejun

AU - Obrien, Peter

PY - 2022/11/16

Y1 - 2022/11/16

N2 - Packaging of photonic integrated circuit (PIC) chips is an essential and critical step before they can be integrated into functional optoelectronic systems. Photonic packaging is however often a major barrier impeding scalable deployment of PIC technologies given its high cost and limited throughput. This perspective addresses the technical challenges and discusses promising strategies and research directions to overcome the "packaging bottleneck".

AB - Packaging of photonic integrated circuit (PIC) chips is an essential and critical step before they can be integrated into functional optoelectronic systems. Photonic packaging is however often a major barrier impeding scalable deployment of PIC technologies given its high cost and limited throughput. This perspective addresses the technical challenges and discusses promising strategies and research directions to overcome the "packaging bottleneck".

KW - Laser integration

KW - Optical coupling

KW - Optoelectronics

KW - Photonic integrated circuits

KW - Photonic packaging

KW - Thermal management

UR - https://www.scopus.com/pages/publications/85140582671

U2 - 10.1021/acsphotonics.2c00891

DO - 10.1021/acsphotonics.2c00891

M3 - Review article

AN - SCOPUS:85140582671

SN - 2330-4022

VL - 9

SP - 3467

EP - 3485

JO - ACS Photonics

JF - ACS Photonics

IS - 11

ER -

Integrated Photonics Packaging: Challenges and Opportunities

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Keywords

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