Abstract
O-band InAs/GaAs Quantum Dot edge-emitting lasers are integrated onto a number of waveguiding platforms using micro-transfer printing. These are deep recesses in 220 nm Si, 3 μm Si and 300 nm SiN waveguide circuits. The processing technology to achieve release and high-yield accurate transfer of laser coupons up to 2.4 mm long and <5 μm thick onto the target substrates is described. At 85 mA, waveguide coupled powers of 1.0 mW and 0.95 mW are measured after out-coupling from the 220 nm SOI and 300 nm SiN waveguides, respectively while 1.7 mW total power was measured from the 3 μm SOI waveguide.
| Original language | English |
|---|---|
| Article number | 1500210 |
| Journal | IEEE Journal of Selected Topics in Quantum Electronics |
| Volume | 29 |
| Issue number | 3 |
| DOIs | |
| Publication status | Published - 1 May 2023 |
Keywords
- data centers
- heterogeneous integration
- semiconductor laser
- Si waveguide
- Silicon photonics
- SiN waveguide