Integration of Edge-Emitting Quantum Dot Lasers With Different Waveguide Platforms Using Micro-Transfer Printing

  • Ali Uzun
  • , Fatih Bilge Atar
  • , Simone Iadanza
  • , Ruggero Loi
  • , Jing Zhang
  • , Gunther Roelkens
  • , Igor Krestnikov
  • , Johanna Rimbock
  • , Liam O'Faolain
  • , Brian Corbett

Research output: Contribution to journalArticlepeer-review

Abstract

O-band InAs/GaAs Quantum Dot edge-emitting lasers are integrated onto a number of waveguiding platforms using micro-transfer printing. These are deep recesses in 220 nm Si, 3 μm Si and 300 nm SiN waveguide circuits. The processing technology to achieve release and high-yield accurate transfer of laser coupons up to 2.4 mm long and <5 μm thick onto the target substrates is described. At 85 mA, waveguide coupled powers of 1.0 mW and 0.95 mW are measured after out-coupling from the 220 nm SOI and 300 nm SiN waveguides, respectively while 1.7 mW total power was measured from the 3 μm SOI waveguide.

Original languageEnglish
Article number1500210
JournalIEEE Journal of Selected Topics in Quantum Electronics
Volume29
Issue number3
DOIs
Publication statusPublished - 1 May 2023

Keywords

  • data centers
  • heterogeneous integration
  • semiconductor laser
  • Si waveguide
  • Silicon photonics
  • SiN waveguide

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