TY - GEN
T1 - Interconnect Physical Analyser (IPAA) applied to the design of scalable network-on-chip interconnect for cryptographic accelerators
AU - English, Tom
AU - Popovici, Emanuel
PY - 2011
Y1 - 2011
N2 - This paper introduces Interconnect Physical Analyser (IPAA) - a tool for the analysis and optimisation of SoC/NoC toplevel interconnect. IPAA extracts information from the IC router and power analysis tool after implementation. Combining information from both sources, the tool performs a wirelength-driven power analysis of toplevel interconnect in the design. A range of statistics for toplevel interconnect is reported and a set of plots is produced. Multiple designs can be analysed simultaneously, enabling comparison and optimisation. The tool is applied to the design of scalable, efficient bus-replacement Network-on-Chip interconnect for Public Key Cryptographic accelerators. IPAA analyses the physical effects of scaling the cryptographic accelerator's floorplan, the number of cores and the cryptographic wordlength. The tool's plots and reports highlight the efficiency and scalability of the bus replacement Network-on-Chip and help guide the optimisation of the design.
AB - This paper introduces Interconnect Physical Analyser (IPAA) - a tool for the analysis and optimisation of SoC/NoC toplevel interconnect. IPAA extracts information from the IC router and power analysis tool after implementation. Combining information from both sources, the tool performs a wirelength-driven power analysis of toplevel interconnect in the design. A range of statistics for toplevel interconnect is reported and a set of plots is produced. Multiple designs can be analysed simultaneously, enabling comparison and optimisation. The tool is applied to the design of scalable, efficient bus-replacement Network-on-Chip interconnect for Public Key Cryptographic accelerators. IPAA analyses the physical effects of scaling the cryptographic accelerator's floorplan, the number of cores and the cryptographic wordlength. The tool's plots and reports highlight the efficiency and scalability of the bus replacement Network-on-Chip and help guide the optimisation of the design.
KW - interconnect
KW - Networks-on-Chip
KW - physical design
UR - https://www.scopus.com/pages/publications/79960334976
U2 - 10.1145/1999946.1999982
DO - 10.1145/1999946.1999982
M3 - Conference proceeding
AN - SCOPUS:79960334976
SN - 9781450307208
T3 - NOCS 2011: The 5th ACM/IEEE International Symposium on Networks-on-Chip
SP - 225
EP - 232
BT - NOCS 2011
T2 - 5th ACM/IEEE International Symposium on Networks-on-Chip, NOCS 2011
Y2 - 1 May 2011 through 4 May 2011
ER -