Investigation of thermo-mechanically induced stress in a PQFP 160 using finite element techniques

G. Kelly; C. Lyden; C. O'Mathuna; J. S. Campbell

Investigation of thermo-mechanically induced stress in a PQFP 160 using finite element techniques

G. Kelly
, C. Lyden
, C. O'Mathuna
, J. S. Campbell

Tyndall IPES (Integrated Power)

Research output: Chapter in Book/Report/Conference proceedings › Conference proceeding › peer-review

Abstract

The authors use finite element (FE) techniques to illustrate how thermomechanical stresses are built up within a plastic IC package, due to encapsulation. Plane strain is chosen as the most suitable 2D FE model for the thermomechanical stress analysis of plastic packages. The compressive stress on the die is separated into direct and bending components of stress. This is used to show that the molding compound induces over half of the encapsulation stress into the die. An explanation of the compressive stress distribution throughout the die is presented. The encapsulation stress on the die can be eliminated by isolating the die from the package with a side buffer of soft material.

Original language	English
Title of host publication	Proceedings - Electronic Components Conference
Publisher	Publ by IEEE
Pages	467-472
Number of pages	6
ISBN (Print)	0818626607
Publication status	Published - Jan 1992
Event	Proceedings of the 42nd Electronic Components and Technology Conference - San Diego, CA, USA Duration: 18 May 1992 → 20 May 1992

Publication series

Name	Proceedings - Electronic Components Conference
ISSN (Print)	0569-5503

Conference

Conference	Proceedings of the 42nd Electronic Components and Technology Conference
City	San Diego, CA, USA
Period	18/05/92 → 20/05/92

Cite this

@inproceedings{3665840eb54d4a3986526110891243f4,

title = "Investigation of thermo-mechanically induced stress in a PQFP 160 using finite element techniques",

abstract = "The authors use finite element (FE) techniques to illustrate how thermomechanical stresses are built up within a plastic IC package, due to encapsulation. Plane strain is chosen as the most suitable 2D FE model for the thermomechanical stress analysis of plastic packages. The compressive stress on the die is separated into direct and bending components of stress. This is used to show that the molding compound induces over half of the encapsulation stress into the die. An explanation of the compressive stress distribution throughout the die is presented. The encapsulation stress on the die can be eliminated by isolating the die from the package with a side buffer of soft material.",

author = "G. Kelly and C. Lyden and C. O'Mathuna and Campbell, \{J. S.\}",

year = "1992",

month = jan,

language = "English",

isbn = "0818626607",

series = "Proceedings - Electronic Components Conference",

publisher = "Publ by IEEE",

pages = "467--472",

booktitle = "Proceedings - Electronic Components Conference",

note = "Proceedings of the 42nd Electronic Components and Technology Conference ; Conference date: 18-05-1992 Through 20-05-1992",

}

Kelly, G, Lyden, C, O'Mathuna, C & Campbell, JS 1992, Investigation of thermo-mechanically induced stress in a PQFP 160 using finite element techniques. in Proceedings - Electronic Components Conference. Proceedings - Electronic Components Conference, Publ by IEEE, pp. 467-472, Proceedings of the 42nd Electronic Components and Technology Conference, San Diego, CA, USA, 18/05/92.

Investigation of thermo-mechanically induced stress in a PQFP 160 using finite element techniques. / Kelly, G.; Lyden, C.; O'Mathuna, C. et al.
Proceedings - Electronic Components Conference. Publ by IEEE, 1992. p. 467-472 (Proceedings - Electronic Components Conference).

Research output: Chapter in Book/Report/Conference proceedings › Conference proceeding › peer-review

TY - GEN

T1 - Investigation of thermo-mechanically induced stress in a PQFP 160 using finite element techniques

AU - Kelly, G.

AU - Lyden, C.

AU - O'Mathuna, C.

AU - Campbell, J. S.

PY - 1992/1

Y1 - 1992/1

N2 - The authors use finite element (FE) techniques to illustrate how thermomechanical stresses are built up within a plastic IC package, due to encapsulation. Plane strain is chosen as the most suitable 2D FE model for the thermomechanical stress analysis of plastic packages. The compressive stress on the die is separated into direct and bending components of stress. This is used to show that the molding compound induces over half of the encapsulation stress into the die. An explanation of the compressive stress distribution throughout the die is presented. The encapsulation stress on the die can be eliminated by isolating the die from the package with a side buffer of soft material.

AB - The authors use finite element (FE) techniques to illustrate how thermomechanical stresses are built up within a plastic IC package, due to encapsulation. Plane strain is chosen as the most suitable 2D FE model for the thermomechanical stress analysis of plastic packages. The compressive stress on the die is separated into direct and bending components of stress. This is used to show that the molding compound induces over half of the encapsulation stress into the die. An explanation of the compressive stress distribution throughout the die is presented. The encapsulation stress on the die can be eliminated by isolating the die from the package with a side buffer of soft material.

UR - https://www.scopus.com/pages/publications/0026676124

M3 - Conference proceeding

AN - SCOPUS:0026676124

SN - 0818626607

T3 - Proceedings - Electronic Components Conference

SP - 467

EP - 472

BT - Proceedings - Electronic Components Conference

PB - Publ by IEEE

T2 - Proceedings of the 42nd Electronic Components and Technology Conference

Y2 - 18 May 1992 through 20 May 1992

ER -

Investigation of thermo-mechanically induced stress in a PQFP 160 using finite element techniques

Abstract

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