Investigation on the microwave performance of a high-speed opto-electronic hybrid integrated platform

Wei Han; Marc Rensing; Xin Wang; Peter O’Brien; Frank H. Peters

Investigation on the microwave performance of a high-speed opto-electronic hybrid integrated platform

University College Cork

Research output: Chapter in Book/Report/Conference proceedings › Chapter › peer-review

Abstract

An opto-electronic hybrid integrated platform was developed to enable the fabrication of broadband, low-cost, and compact transceivers for telecommunications. On this platform, an opto-electronic device such as a high-speed laser or a photodetector chip is integrated with a RF driver or an amplifier IC. A Kovar heatsink with multistep structure is designed for ease of optical coupling using a laser welding process. In order to control the high frequency resonances and improve the signal integrity, AlN based subcircuits are designed to feed the RF and DC signals separately. The interconnection networks between the IC and the optoelectronic device and also between the chips and high-speed transmission lines are carefully investigated to optimize the microwave performances. The influence of the packaging for this opto-electronic integration platform on the microwave performance is also analyzed in detail. The simulation results obtained and successful fabrication of a transmitter module demonstrate that the proposed platform can meet the requirements for high-speed WDM or TDM systems.

Original language	English
Title of host publication	Lecture Notes in Engineering and Computer Science
Editors	A. M. Korsunsky, S. I. Ao, David WL Hukins, Len Gelman, Andrew Hunter
Publisher	Newswood Limited
Pages	1048-1052
Number of pages	5
ISBN (Print)	9789881925213
Publication status	Published - 2012
Event	2012 World Congress on Engineering, WCE 2012 - London, United Kingdom Duration: 4 Jul 2012 → 6 Jul 2012

Publication series

Name	Lecture Notes in Engineering and Computer Science
Volume	2198
ISSN (Print)	2078-0958

Conference

Conference	2012 World Congress on Engineering, WCE 2012
Country/Territory	United Kingdom
City	London
Period	4/07/12 → 6/07/12

Keywords

Driver IC
Opto-electronic hybrid integration
RF resonance
Transceiver module
Transmission line

Cite this

Han, W., Rensing, M., Wang, X., O’Brien, P., & Peters, F. H. (2012). Investigation on the microwave performance of a high-speed opto-electronic hybrid integrated platform. In A. M. Korsunsky, S. I. Ao, D. WL. Hukins, L. Gelman, & A. Hunter (Eds.), Lecture Notes in Engineering and Computer Science (pp. 1048-1052). (Lecture Notes in Engineering and Computer Science; Vol. 2198). Newswood Limited.

Han, Wei ; Rensing, Marc ; Wang, Xin et al. / Investigation on the microwave performance of a high-speed opto-electronic hybrid integrated platform. Lecture Notes in Engineering and Computer Science. editor / A. M. Korsunsky ; S. I. Ao ; David WL Hukins ; Len Gelman ; Andrew Hunter. Newswood Limited, 2012. pp. 1048-1052 (Lecture Notes in Engineering and Computer Science).

@inbook{b9d0611a4c7a4fd287d48da21cb8238c,

title = "Investigation on the microwave performance of a high-speed opto-electronic hybrid integrated platform",

abstract = "An opto-electronic hybrid integrated platform was developed to enable the fabrication of broadband, low-cost, and compact transceivers for telecommunications. On this platform, an opto-electronic device such as a high-speed laser or a photodetector chip is integrated with a RF driver or an amplifier IC. A Kovar heatsink with multistep structure is designed for ease of optical coupling using a laser welding process. In order to control the high frequency resonances and improve the signal integrity, AlN based subcircuits are designed to feed the RF and DC signals separately. The interconnection networks between the IC and the optoelectronic device and also between the chips and high-speed transmission lines are carefully investigated to optimize the microwave performances. The influence of the packaging for this opto-electronic integration platform on the microwave performance is also analyzed in detail. The simulation results obtained and successful fabrication of a transmitter module demonstrate that the proposed platform can meet the requirements for high-speed WDM or TDM systems.",

keywords = "Driver IC, Opto-electronic hybrid integration, RF resonance, Transceiver module, Transmission line",

author = "Wei Han and Marc Rensing and Xin Wang and Peter O{\textquoteright}Brien and Peters, \{Frank H.\}",

year = "2012",

language = "English",

isbn = "9789881925213",

series = "Lecture Notes in Engineering and Computer Science",

publisher = "Newswood Limited",

pages = "1048--1052",

editor = "Korsunsky, \{A. M.\} and Ao, \{S. I.\} and Hukins, \{David WL\} and Len Gelman and Andrew Hunter",

booktitle = "Lecture Notes in Engineering and Computer Science",

address = "Hong Kong",

}

Han, W, Rensing, M, Wang, X, O’Brien, P & Peters, FH 2012, Investigation on the microwave performance of a high-speed opto-electronic hybrid integrated platform. in AM Korsunsky, SI Ao, DWL Hukins, L Gelman & A Hunter (eds), Lecture Notes in Engineering and Computer Science. Lecture Notes in Engineering and Computer Science, vol. 2198, Newswood Limited, pp. 1048-1052, 2012 World Congress on Engineering, WCE 2012, London, United Kingdom, 4/07/12.

Investigation on the microwave performance of a high-speed opto-electronic hybrid integrated platform. / Han, Wei; Rensing, Marc; Wang, Xin et al.
Lecture Notes in Engineering and Computer Science. ed. / A. M. Korsunsky; S. I. Ao; David WL Hukins; Len Gelman; Andrew Hunter. Newswood Limited, 2012. p. 1048-1052 (Lecture Notes in Engineering and Computer Science; Vol. 2198).

Research output: Chapter in Book/Report/Conference proceedings › Chapter › peer-review

TY - CHAP

T1 - Investigation on the microwave performance of a high-speed opto-electronic hybrid integrated platform

AU - Han, Wei

AU - Rensing, Marc

AU - Wang, Xin

AU - O’Brien, Peter

AU - Peters, Frank H.

PY - 2012

Y1 - 2012

N2 - An opto-electronic hybrid integrated platform was developed to enable the fabrication of broadband, low-cost, and compact transceivers for telecommunications. On this platform, an opto-electronic device such as a high-speed laser or a photodetector chip is integrated with a RF driver or an amplifier IC. A Kovar heatsink with multistep structure is designed for ease of optical coupling using a laser welding process. In order to control the high frequency resonances and improve the signal integrity, AlN based subcircuits are designed to feed the RF and DC signals separately. The interconnection networks between the IC and the optoelectronic device and also between the chips and high-speed transmission lines are carefully investigated to optimize the microwave performances. The influence of the packaging for this opto-electronic integration platform on the microwave performance is also analyzed in detail. The simulation results obtained and successful fabrication of a transmitter module demonstrate that the proposed platform can meet the requirements for high-speed WDM or TDM systems.

AB - An opto-electronic hybrid integrated platform was developed to enable the fabrication of broadband, low-cost, and compact transceivers for telecommunications. On this platform, an opto-electronic device such as a high-speed laser or a photodetector chip is integrated with a RF driver or an amplifier IC. A Kovar heatsink with multistep structure is designed for ease of optical coupling using a laser welding process. In order to control the high frequency resonances and improve the signal integrity, AlN based subcircuits are designed to feed the RF and DC signals separately. The interconnection networks between the IC and the optoelectronic device and also between the chips and high-speed transmission lines are carefully investigated to optimize the microwave performances. The influence of the packaging for this opto-electronic integration platform on the microwave performance is also analyzed in detail. The simulation results obtained and successful fabrication of a transmitter module demonstrate that the proposed platform can meet the requirements for high-speed WDM or TDM systems.

KW - Driver IC

KW - Opto-electronic hybrid integration

KW - RF resonance

KW - Transceiver module

KW - Transmission line

UR - https://www.scopus.com/pages/publications/84880716475

M3 - Chapter

AN - SCOPUS:84880716475

SN - 9789881925213

T3 - Lecture Notes in Engineering and Computer Science

SP - 1048

EP - 1052

BT - Lecture Notes in Engineering and Computer Science

A2 - Korsunsky, A. M.

A2 - Ao, S. I.

A2 - Hukins, David WL

A2 - Gelman, Len

A2 - Hunter, Andrew

PB - Newswood Limited

T2 - 2012 World Congress on Engineering, WCE 2012

Y2 - 4 July 2012 through 6 July 2012

ER -

Investigation on the microwave performance of a high-speed opto-electronic hybrid integrated platform

Abstract

Publication series

Conference

Keywords

Other files and links

Fingerprint

Cite this