Iron Doping for Transfer Printed High Speed EAM

Research output: Chapter in Book/Report/Conference proceedingsChapterpeer-review

Abstract

An iron doped InP layer is adopted to achieve a micro transfer printing (MTP) compatible high-speed electro-absorption modulator (EAM). An equivalent circuit model analysis of the transfer printed EAM is presented with a simulated speed up to 45.6 GHz. Fabrication details are also discussed.

Original languageEnglish
Title of host publication2022 European Conference on Optical Communication, ECOC 2022
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781957171159
Publication statusPublished - 2022
Event2022 European Conference on Optical Communication, ECOC 2022 - Basel, Switzerland
Duration: 18 Sep 202222 Sep 2022

Publication series

Name2022 European Conference on Optical Communication, ECOC 2022

Conference

Conference2022 European Conference on Optical Communication, ECOC 2022
Country/TerritorySwitzerland
CityBasel
Period18/09/2222/09/22

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