Large-scale DWDM photonic integrated circuits: A manufacturable and scalable integration platform

Charles H. Joyner; Jacco L. Pleumeekers; Atul Mathur; Peter W. Evans; Damien J.H. Lambert; Sanjeev Murthy; Sheila K. Mathis; Frank H. Peters; Johan Baeck; Mark J. Missey; Andrew G. Dentai; Randal A. Salvatore; Richard P. Schneider; Mehrdad Ziari; Masaki Kato; Radhakrishnan Nagarajan; Jeffrey S. Bostak; Timothy Butrie; Vincent G. Dominic; Mike Kauffman; Richard H. Miles; Matthew L. Mitchell; Alan C. Nilsson; Stephen C. Pennypacker; Rory Schlenker; Robert B. Taylor; Huan Shang Tsai; Michael F. Van Leeuwen; Jonas Webjorn; Drew Perkins; Jagdeep Singh; Stephen G. Grubb; Michael Reffle; David G. Mehuys; Fred A. Kish; David F. Welch

doi:10.1109/LEOS.2005.1548019

Large-scale DWDM photonic integrated circuits: A manufacturable and scalable integration platform

Charles H. Joyner
, Jacco L. Pleumeekers
, Atul Mathur
, Peter W. Evans
, Damien J.H. Lambert
, Sanjeev Murthy
, Sheila K. Mathis
, Frank H. Peters
, Johan Baeck
, Mark J. Missey
, Andrew G. Dentai
, Randal A. Salvatore
, Richard P. Schneider
, Mehrdad Ziari
, Masaki Kato
, Radhakrishnan Nagarajan
, Jeffrey S. Bostak
, Timothy Butrie
, Vincent G. Dominic
, Mike Kauffman

Richard H. Miles, Matthew L. Mitchell, Alan C. Nilsson, Stephen C. Pennypacker, Rory Schlenker, Robert B. Taylor, Huan Shang Tsai, Michael F. Van Leeuwen, Jonas Webjorn, Drew Perkins, Jagdeep Singh, Stephen G. Grubb, Michael Reffle, David G. Mehuys, Fred A. Kish, David F. Welch

Infinera Corporation

Research output: Chapter in Book/Report/Conference proceedings › Conference proceeding › peer-review

Abstract

Commercial scaling of electronic integrated circuits has proceeded at a fast pace once the initial hurdle to integration was overcome. Recently, it has been shown that record active and passive optical device counts, exceeding 50 discrete components, can be incorporated onto a single monolithic 100 Gbps DWDM transmitter PIC InP chip. We will investigate key production metrics for this large-scale PIC commercial device as well as other analogs to other III-V semiconductor commercial devices. Using the yield management tools pioneered by silicon based electronics, we will present data supporting their scalability and the manufacturability of these large-scale PICs.

Original language	English
Title of host publication	18th Annual Meeting of the IEEE Lasers and Electro-Optics Society, LEOS 2005
Pages	344-345
Number of pages	2
DOIs	https://doi.org/10.1109/LEOS.2005.1548019
Publication status	Published - 2005
Externally published	Yes
Event	18th Annual Meeting of the IEEE Lasers and Electro-Optics Society, LEOS 2005 - Sydney, Australia Duration: 22 Oct 2005 → 28 Oct 2005

Publication series

Name	Conference Proceedings - Lasers and Electro-Optics Society Annual Meeting-LEOS
Volume	2005
ISSN (Print)	1092-8081

Conference

Conference	18th Annual Meeting of the IEEE Lasers and Electro-Optics Society, LEOS 2005
Country/Territory	Australia
City	Sydney
Period	22/10/05 → 28/10/05

Access to Document

10.1109/LEOS.2005.1548019

Cite this

Joyner, C. H., Pleumeekers, J. L., Mathur, A., Evans, P. W., Lambert, D. J. H., Murthy, S., Mathis, S. K., Peters, F. H., Baeck, J., Missey, M. J., Dentai, A. G., Salvatore, R. A., Schneider, R. P., Ziari, M., Kato, M., Nagarajan, R., Bostak, J. S., Butrie, T., Dominic, V. G., ... Welch, D. F. (2005). Large-scale DWDM photonic integrated circuits: A manufacturable and scalable integration platform. In 18th Annual Meeting of the IEEE Lasers and Electro-Optics Society, LEOS 2005 (pp. 344-345). Article 1548019 (Conference Proceedings - Lasers and Electro-Optics Society Annual Meeting-LEOS; Vol. 2005). https://doi.org/10.1109/LEOS.2005.1548019

@inproceedings{203088839bef4cfc9e33cdff6def9a48,

title = "Large-scale DWDM photonic integrated circuits: A manufacturable and scalable integration platform",

abstract = "Commercial scaling of electronic integrated circuits has proceeded at a fast pace once the initial hurdle to integration was overcome. Recently, it has been shown that record active and passive optical device counts, exceeding 50 discrete components, can be incorporated onto a single monolithic 100 Gbps DWDM transmitter PIC InP chip. We will investigate key production metrics for this large-scale PIC commercial device as well as other analogs to other III-V semiconductor commercial devices. Using the yield management tools pioneered by silicon based electronics, we will present data supporting their scalability and the manufacturability of these large-scale PICs.",

author = "Joyner, \{Charles H.\} and Pleumeekers, \{Jacco L.\} and Atul Mathur and Evans, \{Peter W.\} and Lambert, \{Damien J.H.\} and Sanjeev Murthy and Mathis, \{Sheila K.\} and Peters, \{Frank H.\} and Johan Baeck and Missey, \{Mark J.\} and Dentai, \{Andrew G.\} and Salvatore, \{Randal A.\} and Schneider, \{Richard P.\} and Mehrdad Ziari and Masaki Kato and Radhakrishnan Nagarajan and Bostak, \{Jeffrey S.\} and Timothy Butrie and Dominic, \{Vincent G.\} and Mike Kauffman and Miles, \{Richard H.\} and Mitchell, \{Matthew L.\} and Nilsson, \{Alan C.\} and Pennypacker, \{Stephen C.\} and Rory Schlenker and Taylor, \{Robert B.\} and Tsai, \{Huan Shang\} and \{Van Leeuwen\}, \{Michael F.\} and Jonas Webjorn and Drew Perkins and Jagdeep Singh and Grubb, \{Stephen G.\} and Michael Reffle and Mehuys, \{David G.\} and Kish, \{Fred A.\} and Welch, \{David F.\}",

year = "2005",

doi = "10.1109/LEOS.2005.1548019",

language = "English",

isbn = "0780392175",

series = "Conference Proceedings - Lasers and Electro-Optics Society Annual Meeting-LEOS",

pages = "344--345",

booktitle = "18th Annual Meeting of the IEEE Lasers and Electro-Optics Society, LEOS 2005",

note = "18th Annual Meeting of the IEEE Lasers and Electro-Optics Society, LEOS 2005 ; Conference date: 22-10-2005 Through 28-10-2005",

}

Joyner, CH, Pleumeekers, JL, Mathur, A, Evans, PW, Lambert, DJH, Murthy, S, Mathis, SK, Peters, FH, Baeck, J, Missey, MJ, Dentai, AG, Salvatore, RA, Schneider, RP, Ziari, M, Kato, M, Nagarajan, R, Bostak, JS, Butrie, T, Dominic, VG, Kauffman, M, Miles, RH, Mitchell, ML, Nilsson, AC, Pennypacker, SC, Schlenker, R, Taylor, RB, Tsai, HS, Van Leeuwen, MF, Webjorn, J, Perkins, D, Singh, J, Grubb, SG, Reffle, M, Mehuys, DG, Kish, FA & Welch, DF 2005, Large-scale DWDM photonic integrated circuits: A manufacturable and scalable integration platform. in 18th Annual Meeting of the IEEE Lasers and Electro-Optics Society, LEOS 2005., 1548019, Conference Proceedings - Lasers and Electro-Optics Society Annual Meeting-LEOS, vol. 2005, pp. 344-345, 18th Annual Meeting of the IEEE Lasers and Electro-Optics Society, LEOS 2005, Sydney, Australia, 22/10/05. https://doi.org/10.1109/LEOS.2005.1548019

Large-scale DWDM photonic integrated circuits: A manufacturable and scalable integration platform. / Joyner, Charles H.; Pleumeekers, Jacco L.; Mathur, Atul et al.
18th Annual Meeting of the IEEE Lasers and Electro-Optics Society, LEOS 2005. 2005. p. 344-345 1548019 (Conference Proceedings - Lasers and Electro-Optics Society Annual Meeting-LEOS; Vol. 2005).

Research output: Chapter in Book/Report/Conference proceedings › Conference proceeding › peer-review

TY - GEN

T1 - Large-scale DWDM photonic integrated circuits

T2 - 18th Annual Meeting of the IEEE Lasers and Electro-Optics Society, LEOS 2005

AU - Joyner, Charles H.

AU - Pleumeekers, Jacco L.

AU - Mathur, Atul

AU - Evans, Peter W.

AU - Lambert, Damien J.H.

AU - Murthy, Sanjeev

AU - Mathis, Sheila K.

AU - Peters, Frank H.

AU - Baeck, Johan

AU - Missey, Mark J.

AU - Dentai, Andrew G.

AU - Salvatore, Randal A.

AU - Schneider, Richard P.

AU - Ziari, Mehrdad

AU - Kato, Masaki

AU - Nagarajan, Radhakrishnan

AU - Bostak, Jeffrey S.

AU - Butrie, Timothy

AU - Dominic, Vincent G.

AU - Kauffman, Mike

AU - Miles, Richard H.

AU - Mitchell, Matthew L.

AU - Nilsson, Alan C.

AU - Pennypacker, Stephen C.

AU - Schlenker, Rory

AU - Taylor, Robert B.

AU - Tsai, Huan Shang

AU - Van Leeuwen, Michael F.

AU - Webjorn, Jonas

AU - Perkins, Drew

AU - Singh, Jagdeep

AU - Grubb, Stephen G.

AU - Reffle, Michael

AU - Mehuys, David G.

AU - Kish, Fred A.

AU - Welch, David F.

PY - 2005

Y1 - 2005

N2 - Commercial scaling of electronic integrated circuits has proceeded at a fast pace once the initial hurdle to integration was overcome. Recently, it has been shown that record active and passive optical device counts, exceeding 50 discrete components, can be incorporated onto a single monolithic 100 Gbps DWDM transmitter PIC InP chip. We will investigate key production metrics for this large-scale PIC commercial device as well as other analogs to other III-V semiconductor commercial devices. Using the yield management tools pioneered by silicon based electronics, we will present data supporting their scalability and the manufacturability of these large-scale PICs.

AB - Commercial scaling of electronic integrated circuits has proceeded at a fast pace once the initial hurdle to integration was overcome. Recently, it has been shown that record active and passive optical device counts, exceeding 50 discrete components, can be incorporated onto a single monolithic 100 Gbps DWDM transmitter PIC InP chip. We will investigate key production metrics for this large-scale PIC commercial device as well as other analogs to other III-V semiconductor commercial devices. Using the yield management tools pioneered by silicon based electronics, we will present data supporting their scalability and the manufacturability of these large-scale PICs.

UR - https://www.scopus.com/pages/publications/33751307445

U2 - 10.1109/LEOS.2005.1548019

DO - 10.1109/LEOS.2005.1548019

M3 - Conference proceeding

AN - SCOPUS:33751307445

SN - 0780392175

SN - 9780780392175

T3 - Conference Proceedings - Lasers and Electro-Optics Society Annual Meeting-LEOS

SP - 344

EP - 345

BT - 18th Annual Meeting of the IEEE Lasers and Electro-Optics Society, LEOS 2005

Y2 - 22 October 2005 through 28 October 2005

ER -

Joyner CH, Pleumeekers JL, Mathur A, Evans PW, Lambert DJH, Murthy S et al. Large-scale DWDM photonic integrated circuits: A manufacturable and scalable integration platform. In 18th Annual Meeting of the IEEE Lasers and Electro-Optics Society, LEOS 2005. 2005. p. 344-345. 1548019. (Conference Proceedings - Lasers and Electro-Optics Society Annual Meeting-LEOS). doi: 10.1109/LEOS.2005.1548019

Large-scale DWDM photonic integrated circuits: A manufacturable and scalable integration platform

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