Laser integration with CMOS assembly process for Si photonics

Ricky Tseng; James O'Callaghan; Feras Eid; Michael Gleeson; Brandon Rawlings; Mauro Kobrinsky; Ibrahim Ban; Roger Nagle; William McFarlane; Brian Corbett; Peter Chang

doi:10.1109/OFC.2014.6886722

Laser integration with CMOS assembly process for Si photonics

Ricky Tseng
, James O'Callaghan
, Feras Eid
, Michael Gleeson
, Brandon Rawlings
, Mauro Kobrinsky
, Ibrahim Ban
, Roger Nagle
, William McFarlane
, Brian Corbett
, Peter Chang

Research output: Chapter in Book/Report/Conference proceedings › Conference proceeding › peer-review

Abstract

High performance laser is integrated on Si substrates with evanescently coupled polymer waveguides. The design allows 2μm misalignment, consistent with CMOS assembly. 4μm gap and 8dB loss were demonstrated with improvement paths to <2dB loss.

Original language	English
Title of host publication	2014 Optical Fiber Communications Conference and Exhibition, OFC 2014
Publisher	Institute of Electrical and Electronics Engineers Inc.
ISBN (Print)	9781557529930
DOIs	https://doi.org/10.1109/OFC.2014.6886722
Publication status	Published - 2014
Event	2014 Optical Fiber Communications Conference and Exhibition, OFC 2014 - San Francisco, CA, United States Duration: 9 Mar 2014 → 13 Mar 2014

Publication series

Name	Conference on Optical Fiber Communication, Technical Digest Series

Conference

Conference	2014 Optical Fiber Communications Conference and Exhibition, OFC 2014
Country/Territory	United States
City	San Francisco, CA
Period	9/03/14 → 13/03/14

Access to Document

10.1109/OFC.2014.6886722

Cite this

Tseng, R., O'Callaghan, J., Eid, F., Gleeson, M., Rawlings, B., Kobrinsky, M., Ban, I., Nagle, R., McFarlane, W., Corbett, B., & Chang, P. (2014). Laser integration with CMOS assembly process for Si photonics. In 2014 Optical Fiber Communications Conference and Exhibition, OFC 2014 Article 6886722 (Conference on Optical Fiber Communication, Technical Digest Series). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/OFC.2014.6886722

@inproceedings{2ff06d1c23154636835bd86361f0dcde,

title = "Laser integration with CMOS assembly process for Si photonics",

abstract = "High performance laser is integrated on Si substrates with evanescently coupled polymer waveguides. The design allows 2μm misalignment, consistent with CMOS assembly. 4μm gap and 8dB loss were demonstrated with improvement paths to <2dB loss.",

author = "Ricky Tseng and James O'Callaghan and Feras Eid and Michael Gleeson and Brandon Rawlings and Mauro Kobrinsky and Ibrahim Ban and Roger Nagle and William McFarlane and Brian Corbett and Peter Chang",

year = "2014",

doi = "10.1109/OFC.2014.6886722",

language = "English",

isbn = "9781557529930",

series = "Conference on Optical Fiber Communication, Technical Digest Series",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

booktitle = "2014 Optical Fiber Communications Conference and Exhibition, OFC 2014",

address = "United States",

note = "2014 Optical Fiber Communications Conference and Exhibition, OFC 2014 ; Conference date: 09-03-2014 Through 13-03-2014",

}

Tseng, R, O'Callaghan, J, Eid, F, Gleeson, M, Rawlings, B, Kobrinsky, M, Ban, I, Nagle, R, McFarlane, W, Corbett, B & Chang, P 2014, Laser integration with CMOS assembly process for Si photonics. in 2014 Optical Fiber Communications Conference and Exhibition, OFC 2014., 6886722, Conference on Optical Fiber Communication, Technical Digest Series, Institute of Electrical and Electronics Engineers Inc., 2014 Optical Fiber Communications Conference and Exhibition, OFC 2014, San Francisco, CA, United States, 9/03/14. https://doi.org/10.1109/OFC.2014.6886722

Laser integration with CMOS assembly process for Si photonics. / Tseng, Ricky; O'Callaghan, James; Eid, Feras et al.
2014 Optical Fiber Communications Conference and Exhibition, OFC 2014. Institute of Electrical and Electronics Engineers Inc., 2014. 6886722 (Conference on Optical Fiber Communication, Technical Digest Series).

Research output: Chapter in Book/Report/Conference proceedings › Conference proceeding › peer-review

TY - GEN

T1 - Laser integration with CMOS assembly process for Si photonics

AU - Tseng, Ricky

AU - O'Callaghan, James

AU - Eid, Feras

AU - Gleeson, Michael

AU - Rawlings, Brandon

AU - Kobrinsky, Mauro

AU - Ban, Ibrahim

AU - Nagle, Roger

AU - McFarlane, William

AU - Corbett, Brian

AU - Chang, Peter

PY - 2014

Y1 - 2014

N2 - High performance laser is integrated on Si substrates with evanescently coupled polymer waveguides. The design allows 2μm misalignment, consistent with CMOS assembly. 4μm gap and 8dB loss were demonstrated with improvement paths to <2dB loss.

AB - High performance laser is integrated on Si substrates with evanescently coupled polymer waveguides. The design allows 2μm misalignment, consistent with CMOS assembly. 4μm gap and 8dB loss were demonstrated with improvement paths to <2dB loss.

UR - https://www.scopus.com/pages/publications/84907410050

U2 - 10.1109/OFC.2014.6886722

DO - 10.1109/OFC.2014.6886722

M3 - Conference proceeding

AN - SCOPUS:84907410050

SN - 9781557529930

T3 - Conference on Optical Fiber Communication, Technical Digest Series

BT - 2014 Optical Fiber Communications Conference and Exhibition, OFC 2014

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 2014 Optical Fiber Communications Conference and Exhibition, OFC 2014

Y2 - 9 March 2014 through 13 March 2014

ER -

Tseng R, O'Callaghan J, Eid F, Gleeson M, Rawlings B, Kobrinsky M et al. Laser integration with CMOS assembly process for Si photonics. In 2014 Optical Fiber Communications Conference and Exhibition, OFC 2014. Institute of Electrical and Electronics Engineers Inc. 2014. 6886722. (Conference on Optical Fiber Communication, Technical Digest Series). doi: 10.1109/OFC.2014.6886722

Laser integration with CMOS assembly process for Si photonics

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