Laser thermal annealing of Ge, optimized for highly activated dopants and diode ION/IOFF ratios

Research output: Chapter in Book/Report/Conference proceedingsChapterpeer-review

Abstract

The authors compared the influence of laser thermal annealing (LTA) and rapid thermal annealing (RTA) on dopant activation and electrical performance of phosphorus and arsenic doped n+/p junction. High carrier concentration above 1020 cm-3 as well as an ION/IOFF ratio of approximately 105 and ideality factor (n) approximately 1.2-1.5 was achieved with LTA. However RTA revealed very high ION/IOFF ratio approximately 107, and n close to 1. Non ideal behavior in LTA diodes is attributed to existence of deep level defects in the junction, contributing to leakage current. Meanwhile ideal behavior of RTA diodes is due to removal of defects in the junction during the high thermal budget.

Original languageEnglish
Title of host publicationProceedings of the International Conference on Ion Implantation Technology
EditorsMulpuri V. Rao
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781479952120
DOIs
Publication statusPublished - 29 Oct 2014
Event20th International Conference on Ion Implantation Technology, IIT 2014 - Portland, United States
Duration: 30 Jun 20144 Jul 2014

Publication series

NameProceedings of the International Conference on Ion Implantation Technology

Conference

Conference20th International Conference on Ion Implantation Technology, IIT 2014
Country/TerritoryUnited States
CityPortland
Period30/06/144/07/14

Keywords

  • dopant activation
  • Ge
  • ideality factor
  • junction
  • Laser thermal annealing
  • leakage current

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