@inproceedings{7a0732db00d7491f81202984017ae188,
title = "Laser to PIC Coupling using Hybrid Photonic Packaging",
abstract = "We demonstrate laser to photonic integrated circuit edge coupling using a III-V/SiN hybrid integration technique. Low coupling loss from the laser to PIC was achieved without the need for any additional coupling optics. Using an active alignment technique, additional loss due to packaging was minimised.",
keywords = "Hybrid Laser Integration, Photonics Packaging, Silicon Photonics",
author = "Butler, \{Sharon M.\} and Matthew Hall and Morrissey, \{Padraic E.\} and Peter O'Brien",
note = "Publisher Copyright: {\textcopyright} 2024 IEEE.; 2024 IEEE Photonics Conference, IPC 2024 ; Conference date: 10-11-2024 Through 14-11-2024",
year = "2024",
doi = "10.1109/IPC60965.2024.10799856",
language = "English",
series = "2024 IEEE Photonics Conference, IPC 2024 - Proceedings",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
booktitle = "2024 IEEE Photonics Conference, IPC 2024 - Proceedings",
address = "United States",
}