TY - CHAP
T1 - Lossless High-speed Silicon Photonic MZI switch with a Micro-Transfer-Printed III-V amplifier
AU - Zhang, Jing
AU - Kruckel, Clemens J.
AU - Haq, Bahawal
AU - Matuskova, Bozena
AU - Rimbock, Johanna
AU - Ertl, Stefan
AU - Gocalinska, Agnieszka
AU - Pelucchi, Emanuele
AU - Corbett, Brian
AU - Van Campenhout, Joris
AU - Lepage, Guy
AU - Verheyen, Peter
AU - Van Thourhout, Dries
AU - Baets, Roel
AU - Roelkens, Gunther
N1 - Publisher Copyright:
© 2022 IEEE.
PY - 2022
Y1 - 2022
N2 - We demonstrate an array of C-band high-speed silicon MZI switches with integrated III-V amplifiers on the imec iSiPP50G platform using micro-transfer printing. The integrated amplifiers exhibit 10 dB optical gain which enables lossless switching and facilitates cross-talk suppression of the switches.
AB - We demonstrate an array of C-band high-speed silicon MZI switches with integrated III-V amplifiers on the imec iSiPP50G platform using micro-transfer printing. The integrated amplifiers exhibit 10 dB optical gain which enables lossless switching and facilitates cross-talk suppression of the switches.
KW - III-V-on-Si amplifier
KW - micro-transfer printing
KW - Silicon photonic MZI switch
UR - https://www.scopus.com/pages/publications/85134699633
U2 - 10.1109/ECTC51906.2022.00077
DO - 10.1109/ECTC51906.2022.00077
M3 - Chapter
AN - SCOPUS:85134699633
T3 - Proceedings - Electronic Components and Technology Conference
SP - 441
EP - 445
BT - Proceedings - IEEE 72nd Electronic Components and Technology Conference, ECTC 2022
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 72nd IEEE Electronic Components and Technology Conference, ECTC 2022
Y2 - 31 May 2022 through 3 June 2022
ER -