Low-leakage ultra-scaled junctions in MOS devices; from fundamentals to improved device performance

  • R. Duffy
  • , A. Heringa
  • , J. Loo
  • , E. Augendre
  • , S. Severi
  • , G. Curatola

Research output: Chapter in Book/Report/Conference proceedingsConference proceedingpeer-review

Abstract

The aim of this work is to design ultra-scaled low-leakage junctions suitable for metal-oxide-semiconductor device scaling in bulk silicon. We begin with fundamental diode characterization analysis. Electrical behavior of fabricated diodes is then used to validate our device simulation modeling methodology, where established models are used to gain further insight and understanding in the junction leakage problem. Based on that effort, innovative junction scaling solutions are generated and realized in a silicon device experiment. Finally improved transistor performance is demonstrated. copyright The Electrochemical Society.

Original languageEnglish
Title of host publicationAdvanced Gate Stack, Source/Drain, and Channel Engineering for Si-Based CMOS 2
Subtitle of host publicationNew Materials, Processes, and Equipment
PublisherElectrochemical Society Inc.
Pages19-33
Number of pages15
Edition2
ISBN (Electronic)1566775027
DOIs
Publication statusPublished - 2006
Externally publishedYes
EventAdvanced Gate Stack, Source/Drain, and Channel Engineering fo Si-Based CMOS 2: New Materials, Processes, and Equipment - 210th Electrochemical Society Meeting - Cancun, Mexico
Duration: 29 Oct 20063 Nov 2006

Publication series

NameECS Transactions
Number2
Volume3
ISSN (Print)1938-5862
ISSN (Electronic)1938-6737

Conference

ConferenceAdvanced Gate Stack, Source/Drain, and Channel Engineering fo Si-Based CMOS 2: New Materials, Processes, and Equipment - 210th Electrochemical Society Meeting
Country/TerritoryMexico
CityCancun
Period29/10/063/11/06

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