@inproceedings{7c5b8c1988ad418790fcdf3e953a0c83,
title = "Magnetics on silicon using electroplated magnetic materials",
abstract = "The use of thin film magnetic materials to enhance the performance of integrated magnetic components on silicon is presented. The magnetic components are processed using thin film, electroplating and MEMS processing materials and technologies. The fabrication processes and materials are described and examples of fabricated miniaturised inductors and transformers are presented and their associated performance characteristics are compared with conventional wire wound and planar magnetic components. The application of the components to enable power supply on chip (PSOC) components is introduced. Finally, technical challenges to be addressed in the future are discussed.",
keywords = "Electroplating, Integrate, Magnetic components, Power supply",
author = "Ningning Wang and Math{\'u}na, \{Sean Cian {\'O}\} and Donnell, \{Terence O.\} and Saibal Roy and Paul McCloskey and Andrew Connell",
year = "2005",
language = "English",
isbn = "9781604235722",
series = "International Microelectronics and Packaging Society - 1st International Conference and Exhibition on Device Packaging 2005: Everything in Electronics Between the Chip and the System",
pages = "138--144",
booktitle = "International Microelectronics and Packaging Society - 1st International Conference and Exhibition on Device Packaging 2005",
note = "1st International Conference and Exhibition on Device Packaging 2005: Everything in Electronics Between the Chip and the System ; Conference date: 13-03-2005 Through 16-03-2005",
}