Abstract
This extended abstract studied the use of spin-on-glass (SOG) for micro-transfer-printing (μTP), as an alternative to conventional polymeric adhesive such as BCB and Intervia. Once cured, SOG behaves as transparent oxide layer and is suitable for rugged environments. The authors demonstrated the μTP of both 200 nm thick lithium niobate films and 3.2 μm thick a-Si cladded lithium niobate chiplets on SOG layer as thin as 50 nm.
| Original language | English (Ireland) |
|---|---|
| Pages | 1-3 |
| Number of pages | 3 |
| Publication status | Published - 9 Jun 2026 |
| Event | 2026 IMAPS Nordic Microelectronics Packaging Conference and Exhibition, NordPac - Stockholm, Sweden Duration: 9 Jun 2026 → 11 Jun 2026 https://nordic.imapseurope.org/nordpac/ |
Conference
| Conference | 2026 IMAPS Nordic Microelectronics Packaging Conference and Exhibition, NordPac |
|---|---|
| Country/Territory | Sweden |
| City | Stockholm |
| Period | 9/06/26 → 11/06/26 |
| Internet address |
Keywords
- Micro-transfer-printing
- Spin-on-glass
- Thin film photonics
- Rugged environment
- Glass interposer
- [Tyndall]
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