Micro-transfer-printing for heterogeneous integration

  • B. Corbett
  • , Z. Li
  • , K. Buehler
  • , F. Naumann
  • , U. Krieger
  • , S. Wicht
  • , C. A. Bower

Research output: Chapter in Book/Report/Conference proceedingsChapterpeer-review

Abstract

Micro-transfer-printing is a key enabling technology for the heterogeneous integration of different materials and devices. The technique is particularly applicable to photonics where a typical system requires diverse arrays of components.

Original languageEnglish
Title of host publicationProceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages34
Number of pages1
ISBN (Electronic)9784904743072
DOIs
Publication statusPublished - May 2019
Event6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019 - Kanazawa, Ishikawa, Japan
Duration: 21 May 201925 May 2019

Publication series

NameProceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019

Conference

Conference6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019
Country/TerritoryJapan
CityKanazawa, Ishikawa
Period21/05/1925/05/19

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