@inproceedings{013ab7efe9c24e12b01af207b1ca1edd,
title = "Micro-transfer-printing of InP Photonic Devices to Silicon Photonics",
abstract = "Micro-transfer-printing (μTP) has been applied to the heterogeneous integration of InP devices to silicon photonics. The technology provides high-throughput parallel transfer of devices, the alignment is achieved through pattern recognition, the accuracy for single posts reaches < ±1.5 μm. A wet-etching technology based on FeCl3:H2O (1: 2) at controlled temperature and InGaAs or InAlAs sacrificial layers allows release InP coupons from the original substrate with selectivity to InP as high as S > 4200. A polymer anchor system has been engineered to restrain the devices to the original substrate during the undercut and to break neatly during the pick-up of the devices. Printing of InP devices has been shown on diverse photonic substrates with and without intermediate metal or adhesive layers. We review the application of μTP to the integration of InP etched facet lasers to the SOI The layout developed is suitable for edge coupling and shows a road map for hybrid polymer-SOI photonic circuits.",
author = "Ruggero Loi and Liam O'Faolain and Emanuele Pelucchi and Brian Corbett and David Gomez and James O'Callaghan and Brendan Roycroft and Trindade, \{Antonio Jose\} and Alin Fecioru and Alex Farrell and Steven Kelleher and Gul, \{Raja Fazan\} and Simone Iadanza",
note = "Publisher Copyright: {\textcopyright} 2019 IEEE.; 2019 PhotonIcs and Electromagnetics Research Symposium - Spring, PIERS-Spring 2019 ; Conference date: 17-06-2019 Through 20-06-2019",
year = "2019",
month = jun,
doi = "10.1109/PIERS-Spring46901.2019.9017709",
language = "English",
series = "Progress in Electromagnetics Research Symposium",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "242--248",
booktitle = "2019 PhotonIcs and Electromagnetics Research Symposium - Spring, PIERS-Spring 2019 - Proceedings",
address = "United States",
}