Microsystem packaging in 3D

G. Kelly; J. Alderman; C. Lyden; J. Barrett; A. Morrissey

doi:10.1117/12.284509

Microsystem packaging in 3D

G. Kelly
, J. Alderman
, C. Lyden
, J. Barrett
, A. Morrissey

Office of the Vice President for Research and Innovation

University College Cork

Research output: Contribution to journal › Article › peer-review

Abstract

Packaging influences the reliability and performance of Microsystems. A brief history of developments in packaging is presented along with an overview of 3D packaging philosophy. An example of the integration of a micromachined silicon membrane pump into a 3D vertical multichip module package (MCM-V) is presented. Finite element techniques are used to analyse the encapsulation stress in the assembled structure to improve the integrity of the packaged microsystem.

Original language	English
Pages (from-to)	142-152
Number of pages	11
Journal	Proceedings of SPIE - The International Society for Optical Engineering
Volume	3224
DOIs	https://doi.org/10.1117/12.284509
Publication status	Published - 1997
Event	Micromachined Devices and Components III - Austin, TX, United States Duration: 29 Sep 1997 → 29 Sep 1997

Keywords

3D MCM-V
Finite element method
Membrane micropump
Micromachining
Packaging, residual stress

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

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10.1117/12.284509

Cite this

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title = "Microsystem packaging in 3D",

abstract = "Packaging influences the reliability and performance of Microsystems. A brief history of developments in packaging is presented along with an overview of 3D packaging philosophy. An example of the integration of a micromachined silicon membrane pump into a 3D vertical multichip module package (MCM-V) is presented. Finite element techniques are used to analyse the encapsulation stress in the assembled structure to improve the integrity of the packaged microsystem.",

keywords = "3D MCM-V, Finite element method, Membrane micropump, Micromachining, Packaging, residual stress",

author = "G. Kelly and J. Alderman and C. Lyden and J. Barrett and A. Morrissey",

year = "1997",

doi = "10.1117/12.284509",

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pages = "142--152",

journal = "Proceedings of SPIE - The International Society for Optical Engineering",

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TY - JOUR

T1 - Microsystem packaging in 3D

AU - Kelly, G.

AU - Alderman, J.

AU - Lyden, C.

AU - Barrett, J.

AU - Morrissey, A.

PY - 1997

Y1 - 1997

N2 - Packaging influences the reliability and performance of Microsystems. A brief history of developments in packaging is presented along with an overview of 3D packaging philosophy. An example of the integration of a micromachined silicon membrane pump into a 3D vertical multichip module package (MCM-V) is presented. Finite element techniques are used to analyse the encapsulation stress in the assembled structure to improve the integrity of the packaged microsystem.

AB - Packaging influences the reliability and performance of Microsystems. A brief history of developments in packaging is presented along with an overview of 3D packaging philosophy. An example of the integration of a micromachined silicon membrane pump into a 3D vertical multichip module package (MCM-V) is presented. Finite element techniques are used to analyse the encapsulation stress in the assembled structure to improve the integrity of the packaged microsystem.

KW - 3D MCM-V

KW - Finite element method

KW - Membrane micropump

KW - Micromachining

KW - Packaging, residual stress

UR - https://www.scopus.com/pages/publications/33749918597

U2 - 10.1117/12.284509

DO - 10.1117/12.284509

M3 - Article

AN - SCOPUS:33749918597

SN - 0277-786X

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EP - 152

JO - Proceedings of SPIE - The International Society for Optical Engineering

JF - Proceedings of SPIE - The International Society for Optical Engineering

T2 - Micromachined Devices and Components III

Y2 - 29 September 1997 through 29 September 1997

ER -

Microsystem packaging in 3D

Abstract

Keywords

UN SDGs

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