TY - CHAP
T1 - Modelling effects of packaging on pull-in behaviour of doubly-anchored beams
AU - Lishchynska, Maryna
AU - O'Mahony, Conor
AU - Slattery, Orla
AU - Wittler, Olaf
PY - 2006
Y1 - 2006
N2 - Understanding the influence of the packaging process on MEMS device performance is critical for a successful design and analysis of both the device and the package. This paper is concerned with accurate prediction of the effects of packaging processes on the pull-in behaviour of doubly anchored microbeams. Results of parametric studies on the effect of gluing (die attach) on the pull-in behaviour of beams of various lengths, widths, anchor types, adhesives and adhesive thicknesses are presented. Where experimental data were available, a good correlation between measured and simulated results was achieved.
AB - Understanding the influence of the packaging process on MEMS device performance is critical for a successful design and analysis of both the device and the package. This paper is concerned with accurate prediction of the effects of packaging processes on the pull-in behaviour of doubly anchored microbeams. Results of parametric studies on the effect of gluing (die attach) on the pull-in behaviour of beams of various lengths, widths, anchor types, adhesives and adhesive thicknesses are presented. Where experimental data were available, a good correlation between measured and simulated results was achieved.
UR - https://www.scopus.com/pages/publications/33847123025
U2 - 10.1109/ESIME.2006.1643946
DO - 10.1109/ESIME.2006.1643946
M3 - Chapter
AN - SCOPUS:33847123025
SN - 1424402751
SN - 9781424402755
T3 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006
BT - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006
T2 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006
Y2 - 24 April 2006 through 26 April 2006
ER -