Modulators in Silicon Photonics—Heterogenous Integration & and Beyond

Jack Mulcahy; Frank H. Peters; Xing Dai

doi:10.3390/photonics9010040

Modulators in Silicon Photonics—Heterogenous Integration & and Beyond

Jack Mulcahy
, Frank H. Peters
, Xing Dai

University College Cork

Research output: Contribution to journal › Review article › peer-review

Abstract

The article below presents a review of current research on silicon photonics. Herein, an overview of current silicon modulator types and modern integration approaches is presented including direct bonding methods and micro-transfer printing. An analysis of current state of the art silicon modulators is also given. Finally, new prospects for III–V-silicon integration are explored and the prospects of an integrated modulator compatible with current CMOS processing is investigated.

Original language	English
Article number	40
Journal	Photonics
Volume	9
Issue number	1
DOIs	https://doi.org/10.3390/photonics9010040
Publication status	Published - Jan 2022

Keywords

Bonding
EAM
EML
III–V materials
Modulator
Silicon photonics

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10.3390/photonics9010040

Cite this

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title = "Modulators in Silicon Photonics—Heterogenous Integration \& and Beyond",

abstract = "The article below presents a review of current research on silicon photonics. Herein, an overview of current silicon modulator types and modern integration approaches is presented including direct bonding methods and micro-transfer printing. An analysis of current state of the art silicon modulators is also given. Finally, new prospects for III–V-silicon integration are explored and the prospects of an integrated modulator compatible with current CMOS processing is investigated.",

keywords = "Bonding, EAM, EML, III–V materials, Modulator, Silicon photonics",

author = "Jack Mulcahy and Peters, \{Frank H.\} and Xing Dai",

note = "Publisher Copyright: {\textcopyright} 2022 by the authors. Licensee MDPI, Basel, Switzerland.",

year = "2022",

month = jan,

doi = "10.3390/photonics9010040",

language = "English",

volume = "9",

journal = "Photonics",

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AU - Peters, Frank H.

AU - Dai, Xing

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N2 - The article below presents a review of current research on silicon photonics. Herein, an overview of current silicon modulator types and modern integration approaches is presented including direct bonding methods and micro-transfer printing. An analysis of current state of the art silicon modulators is also given. Finally, new prospects for III–V-silicon integration are explored and the prospects of an integrated modulator compatible with current CMOS processing is investigated.

AB - The article below presents a review of current research on silicon photonics. Herein, an overview of current silicon modulator types and modern integration approaches is presented including direct bonding methods and micro-transfer printing. An analysis of current state of the art silicon modulators is also given. Finally, new prospects for III–V-silicon integration are explored and the prospects of an integrated modulator compatible with current CMOS processing is investigated.

KW - Bonding

KW - EAM

KW - EML

KW - III–V materials

KW - Modulator

KW - Silicon photonics

UR - https://www.scopus.com/pages/publications/85123517426

U2 - 10.3390/photonics9010040

DO - 10.3390/photonics9010040

M3 - Review article

AN - SCOPUS:85123517426

SN - 2304-6732

VL - 9

JO - Photonics

JF - Photonics

IS - 1

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ER -

Modulators in Silicon Photonics—Heterogenous Integration & and Beyond

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Keywords

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