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Monolithic pixel development in 180 nm CMOS for the outer pixel layers in the ATLAS experiment

  • T. Kugathasan
  • , R. Bates
  • , C. Buttar
  • , I. Berdalovic
  • , B. Blochet
  • , R. Cardella
  • , M. Dalla
  • , N. Egidos Plaja
  • , T. Hemperek
  • , J. W. Van Hoorne
  • , D. Maneuski
  • , C. A. Marin Tobon
  • , K. Moustakas
  • , H. Mugnier
  • , L. Musa
  • , H. Pernegger
  • , P. Riedler
  • , C. Riegel
  • , J. Rousset
  • , C. Sbarra
  • D. Schaefer, E. J. Schioppa, A. Sharma, W. Snoeys, C. Solans Sanchez, T. Wang, N. Wermes
  • CERN
  • University of Glasgow
  • University of Bologna
  • University of Bonn
  • University of Wuppertal
  • University of Oxford

Research output: Contribution to journalArticlepeer-review

Abstract

The ATLAS experiment at CERN plans to upgrade its Inner Tracking System for the High-Luminosity LHC in 2026. After the ALPIDE monolithic sensor for the ALICE ITS was successfully implemented in a 180 nm CMOS Imaging Sensor technology, the process was modified to combine full sensor depletion with a low sensor capacitance (≈ 2.5fF), for increased radiation tolerance and low analog power consumption. Efficiency and charge collection time were measured with comparisons before and after irradiation. This paper summarises the measurements and the ATLAS-specific development towards full-reticle size CMOS sensors and modules in this modified technology.

Original languageEnglish
JournalProceedings of Science
Volume2017-September
Publication statusPublished - 2017
Externally publishedYes
Event2017 Topical Workshop on Electronics for Particle Physics, TWEPP 2017 - Santa Cruz, United States
Duration: 11 Sep 201714 Sep 2017

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