Multi-micron silicon photonics platform for highly manufacturable and versatile photonic integrated circuits

Aaron J. Zilkie; Pradeep Srinivasan; Andrea Trita; Thomas Schrans; Guomin Yu; Jerry Byrd; David A. Nelson; Karl Muth; Damiana Lerose; Mazin Alalusi; Kevin Masuda; Melissa Ziebell; Hooman Abediasl; John Drake; Gerald Miller; Henri Nykanen; Evie Kho; Yangyang Liu; Hong Liang; Hua Yang; Frank H. Peters; Amit S. Nagra; Andrew G. Rickman

doi:10.1109/JSTQE.2019.2911432

Multi-micron silicon photonics platform for highly manufacturable and versatile photonic integrated circuits

Aaron J. Zilkie
, Pradeep Srinivasan
, Andrea Trita
, Thomas Schrans
, Guomin Yu
, Jerry Byrd
, David A. Nelson
, Karl Muth
, Damiana Lerose
, Mazin Alalusi
, Kevin Masuda
, Melissa Ziebell
, Hooman Abediasl
, John Drake
, Gerald Miller
, Henri Nykanen
, Evie Kho
, Yangyang Liu
, Hong Liang
, Hua Yang

Frank H. Peters, Amit S. Nagra, Andrew G. Rickman

Research output: Contribution to journal › Article › peer-review

Abstract

We describe and characterize a multi-micron silicon photonics platform that was designed to combine performance, power efficiency, manufacturability, and versatility for integrated photonic applications ranging from data communications to sensors. We outline the attributes needed for broad applicability, high-volume manufacturing, and large-scale deployment of silicon photonics, and describe how the platform is favorable with respect to these attributes. We present demonstrations of key technologies needed for the communications and sensing applications, including low-loss fiber attach, compact low-loss filters, efficient hybrid wavelength division multiplexed lasers, and high-speed electro-absorption modulators and integrated photodetectors.

Original language	English
Article number	8691800
Journal	IEEE Journal of Selected Topics in Quantum Electronics
Volume	25
Issue number	5
DOIs	https://doi.org/10.1109/JSTQE.2019.2911432
Publication status	Published - 1 Sep 2019

Keywords

hybrid lasers
III-V hybrid integration
integrated optics
optical interconnects
optoelectronics
Photonic integrated circuits
photonic integration
silicon photonics

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

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10.1109/JSTQE.2019.2911432

https://hdl.handle.net/10468/9757Licence: CC BY-NC-ND

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Zilkie, A. J., Srinivasan, P., Trita, A., Schrans, T., Yu, G., Byrd, J., Nelson, D. A., Muth, K., Lerose, D., Alalusi, M., Masuda, K., Ziebell, M., Abediasl, H., Drake, J., Miller, G., Nykanen, H., Kho, E., Liu, Y., Liang, H., ... Rickman, A. G. (2019). Multi-micron silicon photonics platform for highly manufacturable and versatile photonic integrated circuits. IEEE Journal of Selected Topics in Quantum Electronics, 25(5), Article 8691800. https://doi.org/10.1109/JSTQE.2019.2911432

@article{980e8341da81463689848a06bbfa8165,

title = "Multi-micron silicon photonics platform for highly manufacturable and versatile photonic integrated circuits",

abstract = "We describe and characterize a multi-micron silicon photonics platform that was designed to combine performance, power efficiency, manufacturability, and versatility for integrated photonic applications ranging from data communications to sensors. We outline the attributes needed for broad applicability, high-volume manufacturing, and large-scale deployment of silicon photonics, and describe how the platform is favorable with respect to these attributes. We present demonstrations of key technologies needed for the communications and sensing applications, including low-loss fiber attach, compact low-loss filters, efficient hybrid wavelength division multiplexed lasers, and high-speed electro-absorption modulators and integrated photodetectors.",

keywords = "hybrid lasers, III-V hybrid integration, integrated optics, optical interconnects, optoelectronics, Photonic integrated circuits, photonic integration, silicon photonics",

author = "Zilkie, \{Aaron J.\} and Pradeep Srinivasan and Andrea Trita and Thomas Schrans and Guomin Yu and Jerry Byrd and Nelson, \{David A.\} and Karl Muth and Damiana Lerose and Mazin Alalusi and Kevin Masuda and Melissa Ziebell and Hooman Abediasl and John Drake and Gerald Miller and Henri Nykanen and Evie Kho and Yangyang Liu and Hong Liang and Hua Yang and Peters, \{Frank H.\} and Nagra, \{Amit S.\} and Rickman, \{Andrew G.\}",

note = "Publisher Copyright: {\textcopyright} 1995-2012 IEEE.",

year = "2019",

month = sep,

day = "1",

doi = "10.1109/JSTQE.2019.2911432",

language = "English",

volume = "25",

journal = "IEEE Journal of Selected Topics in Quantum Electronics",

issn = "1077-260X",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

number = "5",

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Zilkie, AJ, Srinivasan, P, Trita, A, Schrans, T, Yu, G, Byrd, J, Nelson, DA, Muth, K, Lerose, D, Alalusi, M, Masuda, K, Ziebell, M, Abediasl, H, Drake, J, Miller, G, Nykanen, H, Kho, E, Liu, Y, Liang, H, Yang, H, Peters, FH, Nagra, AS & Rickman, AG 2019, 'Multi-micron silicon photonics platform for highly manufacturable and versatile photonic integrated circuits', IEEE Journal of Selected Topics in Quantum Electronics, vol. 25, no. 5, 8691800. https://doi.org/10.1109/JSTQE.2019.2911432

TY - JOUR

T1 - Multi-micron silicon photonics platform for highly manufacturable and versatile photonic integrated circuits

AU - Zilkie, Aaron J.

AU - Srinivasan, Pradeep

AU - Trita, Andrea

AU - Schrans, Thomas

AU - Yu, Guomin

AU - Byrd, Jerry

AU - Nelson, David A.

AU - Muth, Karl

AU - Lerose, Damiana

AU - Alalusi, Mazin

AU - Masuda, Kevin

AU - Ziebell, Melissa

AU - Abediasl, Hooman

AU - Drake, John

AU - Miller, Gerald

AU - Nykanen, Henri

AU - Kho, Evie

AU - Liu, Yangyang

AU - Liang, Hong

AU - Yang, Hua

AU - Peters, Frank H.

AU - Nagra, Amit S.

AU - Rickman, Andrew G.

PY - 2019/9/1

Y1 - 2019/9/1

N2 - We describe and characterize a multi-micron silicon photonics platform that was designed to combine performance, power efficiency, manufacturability, and versatility for integrated photonic applications ranging from data communications to sensors. We outline the attributes needed for broad applicability, high-volume manufacturing, and large-scale deployment of silicon photonics, and describe how the platform is favorable with respect to these attributes. We present demonstrations of key technologies needed for the communications and sensing applications, including low-loss fiber attach, compact low-loss filters, efficient hybrid wavelength division multiplexed lasers, and high-speed electro-absorption modulators and integrated photodetectors.

AB - We describe and characterize a multi-micron silicon photonics platform that was designed to combine performance, power efficiency, manufacturability, and versatility for integrated photonic applications ranging from data communications to sensors. We outline the attributes needed for broad applicability, high-volume manufacturing, and large-scale deployment of silicon photonics, and describe how the platform is favorable with respect to these attributes. We present demonstrations of key technologies needed for the communications and sensing applications, including low-loss fiber attach, compact low-loss filters, efficient hybrid wavelength division multiplexed lasers, and high-speed electro-absorption modulators and integrated photodetectors.

KW - hybrid lasers

KW - III-V hybrid integration

KW - integrated optics

KW - optical interconnects

KW - optoelectronics

KW - Photonic integrated circuits

KW - photonic integration

KW - silicon photonics

UR - https://www.scopus.com/pages/publications/85066618929

U2 - 10.1109/JSTQE.2019.2911432

DO - 10.1109/JSTQE.2019.2911432

M3 - Article

AN - SCOPUS:85066618929

SN - 1077-260X

VL - 25

JO - IEEE Journal of Selected Topics in Quantum Electronics

JF - IEEE Journal of Selected Topics in Quantum Electronics

IS - 5

M1 - 8691800

ER -

Multi-micron silicon photonics platform for highly manufacturable and versatile photonic integrated circuits

Abstract

Keywords

UN SDGs

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