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Nanowire, ACF, for, ultrafine-pitch, flip-chip, interconnection
Kafil M. Razeeb
, Jing Tao
, Frank Stam
Tyndall Photonics
Tyndall IPES (Energy4IOT)
University College Cork
Research output
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Chapter in Book/Report/Conference proceedings
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Chapter
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peer-review
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Weight
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Engineering
Nanowire
100%
Anisotropic Conductive Film
100%
Limitations
40%
Anisotropic
40%
Low-Temperature
40%
Interconnects
20%
Microelectronics
20%
High Aspect Ratio
20%
Systems Performance
20%
Film Material
20%
Conductive
20%
Increasing Temperature
20%
Intermetallics
20%
System Cost
20%
Conductive Adhesive
20%
Reliability Issue
20%
Conductive Particle
20%
Autocorrelation Function
20%
Bonding Material
20%
Material Science
Nanowire
100%
Conductive Film
100%
Electrodeposition
20%
Density
20%
Intermetallics
20%
Particle Agglomeration
20%
Chemical Engineering
Film
100%
Nanowire
100%
Electrodeposition
20%