Ni, Pt, and Ti stanogermanide formation on Ge0.92Sn0.08

  • Emmanuele Galluccio
  • , Nikolay Petkov
  • , Gioele Mirabelli
  • , Jessica Doherty
  • , Shih Va Lin
  • , Fang Liang Lu
  • , Chee Wee Liu
  • , Justin D. Holmes
  • , Ray Duffy

Research output: Chapter in Book/Report/Conference proceedingsChapterpeer-review

Abstract

The aim of this work is to provide a systematic and comparative study on the material characteristics and electrical contact performance for a germanium-tin (GeSn) alloy with a high percentage of Sn (8%). Thin metal films (10 nm) of Nickel (Ni), Titanium (Ti), or Platinum (Pt) were deposited on Ge0.92Sn0.08 layers and subsequently annealed at different temperatures ranging from 300°C up to 500°C. Various experimental techniques were employed to characterize the metal morphology and the electrical contact behavior, with the intention of identifying the most promising metal candidate, in terms of low sheet resistance and low surface roughness, considering a low formation temperature. The investigations carried out show that for nano-electronic contact applications, nickel-stanogermanide (NiGeSn) turns out to be the most promising candidate among the three different metals analyzed. NiGeSn presents low sheet resistance combined with low formation temperatures, below 400°C; PtGeSn shows better thermal stability when compared to the other two options while, Ti was found to be unreactive below 500°C, resulting in incomplete TiGeSn formation.

Original languageEnglish
Title of host publication2019 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon, EUROSOI-ULIS 2019
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781728116587
DOIs
Publication statusPublished - Apr 2019
Event2019 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon, EUROSOI-ULIS 2019 - Grenoble, France
Duration: 1 Apr 20193 Apr 2019

Publication series

Name2019 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon, EUROSOI-ULIS 2019

Conference

Conference2019 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon, EUROSOI-ULIS 2019
Country/TerritoryFrance
CityGrenoble
Period1/04/193/04/19

Keywords

  • GeSn
  • sheet resistance
  • stanogermanide

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