Abstract
This chapter presents a paper that describes a novel processing technique termed Ultra Violet Rapid Thermal Processing (UV-RTP), which is used for reduced temperature crystallization of ferroelectric thin-films. These materials are attracting major research interest in applications, such as pyroelectric sensors and micro-electromechanical systems because of their superior properties. Furnaces and RTP units find a wide range of application in semi-conductor manufacturing, such as oxidation, nitridation, annealing, and glass-reflow processing. Although conventional furnace technology has been established for much longer than RTP technology, RTP has a number of attractive features, which offer advantages over furnace processing. There is no time delay in heating and cooling in RTP. Additionally, the lower-thermal budget of an RTP system means that even a single-wafer system can have competitive throughput. It is the associated rapid temperature ramp that is of most interest in the area of ferroelectric materials development. Ferroelectrics are materials that have a spontaneous electric polarisation, the direction of which can be reversed by the application of an external electric field. They display dielectric properties, along with piezoelectric and pyroelectric properties.
| Original language | English |
|---|---|
| Title of host publication | Rapid Thermal Processing for Future Semiconductor Devices |
| Publisher | Elsevier B.V. |
| Pages | 75-82 |
| Number of pages | 8 |
| ISBN (Print) | 9780444513397 |
| DOIs | |
| Publication status | Published - Apr 2003 |
UN SDGs
This output contributes to the following UN Sustainable Development Goals (SDGs)
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SDG 9 Industry, Innovation, and Infrastructure
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