Nucleation and chemical transformation of RuO2 films grown on (100) Si substrates by atomic layer deposition

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Abstract

We describe the formation of RuO2 thin films grown using atomic layer deposition (ALD) on (100) Si substrates from Ru(EtCp)2 and O2, and the subsequent influence of annealing temperature and atmosphere on the surface morphology and structure of the deposited layers. The films are characterized using scanning electron microscopy (SEM), atomic force microscopy (AFM), X-ray diffraction (XRD), transmission electron microscopy (TEM), and electron diffraction (ED). The as-deposited films consist of RuO 2 islands. No significant changes in composition or morphology are observed following annealing in N2 for 4 h at either 500 or 700°C. Higher temperature annealing in N2 (820°C, 4 h) results in some modifications to the morphology and structure where ED data indicate the formation of some Ru metal. However, complete transformation from as-deposited RuO2 to Ru metal is, obtained after annealing in forming gas (95% N2/5% H2) at 420°C for 5 min.

Original languageEnglish
Pages (from-to)114-122
Number of pages9
JournalChemical Vapor Deposition
Volume17
Issue number4-6
DOIs
Publication statusPublished - Jun 2011

Keywords

  • Atomic force microscopy
  • Atomic layer deposition
  • Copper diffusion barriers
  • Interconnect
  • Ruthenium oxide
  • Transmission electron microscopy
  • X-ray diffraction

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