Abstract
We demonstrated a photonic integrated circuit (PIC) with heterogeneously integrated InP-based lasers and uni-travelling carrier photodiodes (UTC-PD) for microwave photonics applications. The InP components are integrated via the micro-transfer printing (MTP) technique, which allows scalable manufacturing process of the microwave photonic chips. We used the photonic circuit to form an external cavity with the transfer printed laser device and achieved tunable single frequency lasing for use in heterodyne radio frequency (RF) generation. The heterogeneously integrated UTC-PDs had 80 GHz bandwidth, and we validated RF generation on UTC-PD with the emission from an on-chip laser.
| Original language | English |
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| Title of host publication | 2024 International Topical Meeting on Microwave Photonics, MWP 2024 |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| ISBN (Electronic) | 9798350375398 |
| DOIs | |
| Publication status | Published - 2024 |
| Event | 2024 International Topical Meeting on Microwave Photonics, MWP 2024 - Pisa, Italy Duration: 17 Sep 2024 → 20 Sep 2024 |
Publication series
| Name | 2024 International Topical Meeting on Microwave Photonics, MWP 2024 |
|---|
Conference
| Conference | 2024 International Topical Meeting on Microwave Photonics, MWP 2024 |
|---|---|
| Country/Territory | Italy |
| City | Pisa |
| Period | 17/09/24 → 20/09/24 |
UN SDGs
This output contributes to the following UN Sustainable Development Goals (SDGs)
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SDG 9 Industry, Innovation, and Infrastructure
Keywords
- heterogeneous integration
- integrated microwave photonics
- micro-transfer printing
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