TY - GEN
T1 - On-chip optical interconnect on silicon by transfer printing
AU - Liu, Lei
AU - Loi, Ruggero
AU - Roycroft, Brendan
AU - Oacallaghan, James
AU - Justice, John
AU - Trindade, Antonio Jose
AU - Kelleher, Steven
AU - Gocalinska, Agnieszka
AU - Thomas, Kevin
AU - Pelucchi, Emanuele
AU - Bower, Christopher A.
AU - Corbett, Brian
N1 - Publisher Copyright:
© 2018 OSA.
PY - 2018/8/6
Y1 - 2018/8/6
N2 - On-chip optical interconnects consisting of transfer-printed micro-LEDs and photodiodes are presented. Static and dynamic data transmission and bi-directional interconnect are demonstrated. The results show the potential for cost-effective and small form-factor on-chip opto-isolators.
AB - On-chip optical interconnects consisting of transfer-printed micro-LEDs and photodiodes are presented. Static and dynamic data transmission and bi-directional interconnect are demonstrated. The results show the potential for cost-effective and small form-factor on-chip opto-isolators.
UR - https://www.scopus.com/pages/publications/85052561095
M3 - Conference proceeding
AN - SCOPUS:85052561095
SN - 9781943580422
T3 - 2018 Conference on Lasers and Electro-Optics, CLEO 2018 - Proceedings
BT - 2018 Conference on Lasers and Electro-Optics, CLEO 2018 - Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2018 Conference on Lasers and Electro-Optics, CLEO 2018
Y2 - 13 May 2018 through 18 May 2018
ER -