Opportunities for Micro-Transfer Printing Techniques in Advanced Packaging

Parnika Gupta; How Yuan Hwang; Saif Wakeel; Sambuddha Khan; Zhi Li; Brian Corbett; Peter O’ Brien

Opportunities for Micro-Transfer Printing Techniques in Advanced Packaging

Parnika Gupta
, How Yuan Hwang
, Saif Wakeel
, Sambuddha Khan
, Zhi Li
, Brian Corbett
, Peter O’ Brien

Tyndall Photonics

Research output: Other output › peer-review

Original language	English
Publication status	Published - Jul 2024

Cite this

TY - GEN

T1 - Opportunities for Micro-Transfer Printing Techniques in Advanced Packaging

AU - Gupta, Parnika

AU - Hwang, How Yuan

AU - Wakeel, Saif

AU - Khan, Sambuddha

AU - Li, Zhi

AU - Corbett, Brian

AU - Brien, Peter O’

PY - 2024/7

Y1 - 2024/7

UR - https://www.ieee.org/ns/periodicals/EPS/Jul2024/index.html?mkt_tok=NzU2LUdQSC04OTkAAAGUfjiTLTu84pcJ6auZcT6_6_6RPaCtmvb-36fTRB2uBe7osqZY3kzqIOwPrU91-cHBdL5itpnENIoUagNhszK6JvlOFp5aj_XsUloaeV_f8P_U

M3 - Other output

ER -

Opportunities for Micro-Transfer Printing Techniques in Advanced Packaging

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