@inproceedings{d07f797807af426999801fbaf284af09,
title = "Optical and electronic packaging process for silicon photonic systems",
abstract = "Fibre optic interconnection processes and hybrid integration of electronic devices for highspeed Si photonic systems are presented. An overview of ePIXfab which offers affordable access to an advanced Si photonic foundry service is also presented.",
author = "Nicola Pavarelli and Lee, \{Jun Su\} and Marc Rensing and Cormac Eason and O'Brien, \{Peter A.\}",
note = "Publisher Copyright: {\textcopyright} 2014 Systematic Paris Region Systems and ICT Cluster.; 2014 European Conference on Optical Communication, ECOC 2014 ; Conference date: 21-09-2014 Through 25-09-2014",
year = "2014",
month = nov,
day = "20",
doi = "10.1109/ECOC.2014.6964237",
language = "English",
series = "European Conference on Optical Communication, ECOC",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
booktitle = "European Conference on Optical Communication, ECOC",
address = "United States",
}