Optimisation and scaling of interfacial GeO 2 layers for high-k gate stacks on germanium and extraction of dielectric constant of GeO 2

  • S. N.Ali Murad
  • , D. W. McNeill
  • , S. J.N. Mitchell
  • , B. M. Armstrong
  • , M. Modreanu
  • , G. Hughes
  • , R. K. Chellappan

Research output: Chapter in Book/Report/Conference proceedingsChapterpeer-review

Abstract

Germanium is an attractive channel material for MOSFETs because of its higher mobility than silicon. In this paper, GeO 2 has been investigated as an interfacial layer for high-k gate stacks. Thermally grown GeO 2 layers have been prepared at 550 C to minimize GeO volatilization. GeO 2 growth has been performed in both pure O 2 ambient and O 2 diluted with N 2. GeO 2 thickness has been scaled down to 3.15 nm. MOS capacitors have been fabricated using different GeO 2 thicknesses with a standard high-K dielectric on top. Electrical properties and thermal stability have been tested up to at least 350C. The k value of GeO 2 was calculated as 4.5. Interface state densities (D it) of less than 10 12 cm 2 eV 1 have been extracted for all devices using the conductance method.

Original languageEnglish
Title of host publication2011 International Semiconductor Device Research Symposium, ISDRS 2011
DOIs
Publication statusPublished - 2011
Event2011 International Semiconductor Device Research Symposium, ISDRS 2011 - College Park, MD, United States
Duration: 7 Dec 20119 Dec 2011

Publication series

Name2011 International Semiconductor Device Research Symposium, ISDRS 2011

Conference

Conference2011 International Semiconductor Device Research Symposium, ISDRS 2011
Country/TerritoryUnited States
CityCollege Park, MD
Period7/12/119/12/11

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