Optimisation and scaling of interfacial GeO 2 layers for high-κ gate stacks on germanium and extraction of dielectric constant of GeO 2

  • S. N.A. Murad
  • , P. T. Baine
  • , D. W. McNeill
  • , S. J.N. Mitchell
  • , B. M. Armstrong
  • , M. Modreanu
  • , G. Hughes
  • , R. K. Chellappan

Research output: Contribution to journalArticlepeer-review

Abstract

Germanium is an attractive channel material for MOSFETs because of its higher mobility than silicon. In this paper, GeO 2 has been investigated as an interfacial layer for high-κ gate stacks on germanium. Thermally grown GeO 2 layers have been prepared at 550 °C to minimise GeO volatilisation. GeO 2 growth has been performed in both pure O 2 ambient and O 2 diluted with N 2. GeO 2 thickness has been scaled down to approximately 3 nm. MOS capacitors have been fabricated using different GeO 2 thicknesses with a standard high-κ dielectric on top. Electrical properties and thermal stability have been tested up to at least 350 °C. The κ value of GeO 2 was experimentally determined to be 4.5. Interface state densities (D it) of less than 10 12 cm -2 eV -1 have been extracted for all devices using the conductance method. front matter

Original languageEnglish
Pages (from-to)136-140
Number of pages5
JournalSolid-State Electronics
Volume78
DOIs
Publication statusPublished - Dec 2012

Keywords

  • Germanium
  • High-κ gate stacks
  • MOS capacitors
  • Thermal GeO growth

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