@inbook{b6f5c76b85ef4985b0d77f0b67c65806,
title = "Opto-electronic hybrid integrated platform for high-speed telecom/datacom applications: Microwave design and optimization",
abstract = "An opto-electronic hybrid integrated platform was developed to enable the fabrication of broadband, low-cost, and compact transceivers for telecommunications. On this platform, an opto-electronic device such as a high-speed laser or a photodetector chip is integrated with a RF driver or an amplifier IC. A Kovar heatsink with multistep structure is designed for ease of optical coupling using a laser welding process. In order to control the high frequency resonances and improve the signal integrity, AlN based subcircuits are designed to feed the RF and DC signals separately. The interconnection networks between the IC and the opto-electronic device and also between the chips and high-speed transmission lines are carefully investigated to optimize the microwave performances. The influence of the packaging for this opto-electronic integration platform on the microwave performance is also analyzed in detail. The simulation results obtained and successful fabrication of a transmitter module demonstrate that the proposed platform can meet the requirements for high-speed WDM or TDM systems.",
keywords = "Driver IC, Microwave transmission, Opto-electronic hybrid integration, RF resonance, Transceiver module, Transmission line",
author = "Wei Han and Marc Rensing and Xin Wang and Peter O'Brien and Peters, \{Frank H.\}",
year = "2013",
doi = "10.1007/978-94-007-6190-2\_20",
language = "English",
isbn = "9789400761896",
series = "Lecture Notes in Electrical Engineering",
publisher = "Springer Verlag",
pages = "259--271",
booktitle = "IAENG Transactions on Engineering Technologies - Special Volume of the World Congress on Engineering 2012",
address = "Germany",
note = "2012 World Congress on Engineering, WCE 2012 ; Conference date: 04-07-2012 Through 06-07-2012",
}