Overview of advanced optical interconnect technologies, processes, and equipment in co-packaged optics

Matthew L. Hall; Das Kumar; Xiuyun He; Kevin Shortiss; Sharon Butler; Kamil Gradkowski; Padraic E. Morrissey; Peter O'Brien

doi:10.1364/BICOP.2025.Tu1A.4

Overview of advanced optical interconnect technologies, processes, and equipment in co-packaged optics

Matthew L. Hall
, Das Kumar
, Xiuyun He
, Kevin Shortiss
, Sharon Butler
, Kamil Gradkowski
, Padraic E. Morrissey
, Peter O'Brien

Tyndall Photonics

Research output: Contribution to conference › Paper › peer-review

Abstract

An overview of advanced optical interconnects is presented in the context of co-packaged optics, including high-density optical interconnects, 3D printed micro-optics, and novel glass interposer technologies, which are key to overcoming key photonics packaging challenges.

Original language	English
Pages	1-2
Number of pages	2
DOIs	https://doi.org/10.1364/BICOP.2025.Tu1A.4
Publication status	Published - 30 Dec 2025
Event	2025 British and Irish Conference on Optics and Photonics, BICOP 2025 - London, United Kingdom Duration: 15 Dec 2025 → 18 Dec 2025

Conference

Conference	2025 British and Irish Conference on Optics and Photonics, BICOP 2025
Country/Territory	United Kingdom
City	London
Period	15/12/25 → 18/12/25

Keywords

Advanced optical interconnect technologies
[TyndallPhotonics]
Processes
Equipment
Co-packaged optics
Optics
Advanced optical interconnects

Access to Document

10.1364/BICOP.2025.Tu1A.4

bicop-2025-tu1a.4Final published version, 345 KB

Cite this

Hall, M. L., Kumar, D., He, X., Shortiss, K., Butler, S., Gradkowski, K., Morrissey, P. E., & O'Brien, P. (2025). Overview of advanced optical interconnect technologies, processes, and equipment in co-packaged optics. 1-2. Paper presented at 2025 British and Irish Conference on Optics and Photonics, BICOP 2025, London, United Kingdom. https://doi.org/10.1364/BICOP.2025.Tu1A.4

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abstract = "An overview of advanced optical interconnects is presented in the context of co-packaged optics, including high-density optical interconnects, 3D printed micro-optics, and novel glass interposer technologies, which are key to overcoming key photonics packaging challenges.",

keywords = "Advanced optical interconnect technologies, [TyndallPhotonics], Processes, Equipment, Co-packaged optics, Optics, Advanced optical interconnects",

author = "Hall, \{Matthew L.\} and Das Kumar and Xiuyun He and Kevin Shortiss and Sharon Butler and Kamil Gradkowski and Morrissey, \{Padraic E.\} and Peter O'Brien",

note = "{\textcopyright} 2025 The Author(s).; 2025 British and Irish Conference on Optics and Photonics, BICOP 2025 ; Conference date: 15-12-2025 Through 18-12-2025",

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month = dec,

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doi = "10.1364/BICOP.2025.Tu1A.4",

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Hall, ML, Kumar, D, He, X, Shortiss, K, Butler, S, Gradkowski, K , Morrissey, PE & O'Brien, P 2025, 'Overview of advanced optical interconnect technologies, processes, and equipment in co-packaged optics', Paper presented at 2025 British and Irish Conference on Optics and Photonics, BICOP 2025, London, United Kingdom, 15/12/25 - 18/12/25 pp. 1-2. https://doi.org/10.1364/BICOP.2025.Tu1A.4

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AU - Hall, Matthew L.

AU - Kumar, Das

AU - He, Xiuyun

AU - Shortiss, Kevin

AU - Butler, Sharon

AU - Gradkowski, Kamil

AU - Morrissey, Padraic E.

AU - O'Brien, Peter

PY - 2025/12/30

Y1 - 2025/12/30

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KW - [TyndallPhotonics]

KW - Processes

KW - Equipment

KW - Co-packaged optics

KW - Optics

KW - Advanced optical interconnects

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M3 - Paper

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T2 - 2025 British and Irish Conference on Optics and Photonics, BICOP 2025

Y2 - 15 December 2025 through 18 December 2025

ER -

Overview of advanced optical interconnect technologies, processes, and equipment in co-packaged optics

Abstract

Conference

Keywords

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