Packaging and integration technologies for future high-frequency power supplies

  • Seán Cian Ó Mathúna
  • , Patrick Byrne
  • , Gerald Duffy
  • , Weimin Chen
  • , Matthias Ludwig
  • , Terence O'Donnell
  • , Paul McCloskey
  • , Maeve Duffy

Research output: Contribution to journal › Article › peer-review

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