Packaging and thermal evaluation of thermally operated intelligent micropump unit

A. Morrissey; J. Alderman; G. Kelly; Zs Kohári; A. Páhi; M. Rencz

doi:10.1016/S0026-2692(99)00072-5

Packaging and thermal evaluation of thermally operated intelligent micropump unit

A. Morrissey
, J. Alderman
, G. Kelly
, Zs Kohári
, A. Páhi
, M. Rencz

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Research output: Contribution to journal › Article › peer-review

Abstract

After presenting the challenges and solutions of the 3D packaging of a medical implant MEMS device the paper presents thermal simulations on the structure. Using this simulation problem as a case study various features of the SUNRED and SYSTUS 3D simulators are compared in the paper.

Original language	English
Pages (from-to)	1109-1114
Number of pages	6
Journal	Microelectronics Journal
Volume	30
Issue number	11
DOIs	https://doi.org/10.1016/S0026-2692(99)00072-5
Publication status	Published - Nov 1999
Event	Proceedings of the 1998 Workshop on Thermal Investigations of ICS and Microstructures (THERMINIC) - Cannes, France Duration: 27 Sep 1998 → 29 Sep 1998

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10.1016/S0026-2692(99)00072-5

Cite this

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title = "Packaging and thermal evaluation of thermally operated intelligent micropump unit",

abstract = "After presenting the challenges and solutions of the 3D packaging of a medical implant MEMS device the paper presents thermal simulations on the structure. Using this simulation problem as a case study various features of the SUNRED and SYSTUS 3D simulators are compared in the paper.",

author = "A. Morrissey and J. Alderman and G. Kelly and Zs Koh{\'a}ri and A. P{\'a}hi and M. Rencz",

year = "1999",

month = nov,

doi = "10.1016/S0026-2692(99)00072-5",

language = "English",

volume = "30",

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journal = "Microelectronics Journal",

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note = "Proceedings of the 1998 Workshop on Thermal Investigations of ICS and Microstructures (THERMINIC) ; Conference date: 27-09-1998 Through 29-09-1998",

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T1 - Packaging and thermal evaluation of thermally operated intelligent micropump unit

AU - Morrissey, A.

AU - Alderman, J.

AU - Kelly, G.

AU - Kohári, Zs

AU - Páhi, A.

AU - Rencz, M.

PY - 1999/11

Y1 - 1999/11

N2 - After presenting the challenges and solutions of the 3D packaging of a medical implant MEMS device the paper presents thermal simulations on the structure. Using this simulation problem as a case study various features of the SUNRED and SYSTUS 3D simulators are compared in the paper.

AB - After presenting the challenges and solutions of the 3D packaging of a medical implant MEMS device the paper presents thermal simulations on the structure. Using this simulation problem as a case study various features of the SUNRED and SYSTUS 3D simulators are compared in the paper.

UR - https://www.scopus.com/pages/publications/0033365386

U2 - 10.1016/S0026-2692(99)00072-5

DO - 10.1016/S0026-2692(99)00072-5

M3 - Article

AN - SCOPUS:0033365386

SN - 0026-2692

VL - 30

SP - 1109

EP - 1114

JO - Microelectronics Journal

JF - Microelectronics Journal

IS - 11

T2 - Proceedings of the 1998 Workshop on Thermal Investigations of ICS and Microstructures (THERMINIC)

Y2 - 27 September 1998 through 29 September 1998

ER -

Packaging and thermal evaluation of thermally operated intelligent micropump unit

Abstract

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