Packaging and thermal evaluation of thermally operated intelligent micropump unit

  • A. Morrissey
  • , J. Alderman
  • , G. Kelly
  • , Zs Kohári
  • , A. Páhi
  • , M. Rencz

Research output: Contribution to journal › Article › peer-review

Fingerprint

Dive into the research topics of 'Packaging and thermal evaluation of thermally operated intelligent micropump unit'. Together they form a unique fingerprint.

Engineering

Material Science

Computer Science