@inbook{e67ead1f73c74fa8aa234c494905c745,
title = "Packaging of 50 × 50 MEMS-actuated silicon photonics switching device",
abstract = "We report on the packaging of the 50 × 50 MEMS-actuated silicon photonics switching device through flip-chip assembly and a lidless 64-channel fibre array polished at 13° angle. The device, measuring 10 mm × 10 mm, contains more than 2500 bond pads with a dimension of 65 μm × 65 μm, with the actuating MEMS structures locating 15 μm away at 4 sides of each bond pads. An average switching voltage of 35 V recorded at package level complies with data recorded during device probing while fibre-to-grating coupler loss was measured to be 4.25dB / facet at around 1550nm.",
keywords = "data centre, interposer, MEMS, optical switch, silicon photonic packaging",
author = "Hwang, \{How Yuan\} and Lee, \{Jun Su\} and Seok, \{Tae Joon\} and Lee Carroll and Wu, \{Ming C.\} and Peter O'Brien",
note = "Publisher Copyright: {\textcopyright} 2016 IEEE.; 18th IEEE Electronics Packaging Technology Conference, EPTC 2016 ; Conference date: 30-11-2016 Through 03-12-2016",
year = "2017",
month = feb,
day = "21",
doi = "10.1109/EPTC.2016.7861480",
language = "English",
series = "Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference, EPTC 2016",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "245--249",
booktitle = "Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference, EPTC 2016",
address = "United States",
}