Packaging of silicon photonic devices: From prototypes to production

Padraic E. Morrissey; Kamil Gradkowski; Lee Carroll; Peter O'Brien

doi:10.1117/12.2292674

Packaging of silicon photonic devices: From prototypes to production

Research output: Chapter in Book/Report/Conference proceedings › Conference proceeding › peer-review

Abstract

The challenges associated with the photonic packaging of silicon devices is often underestimated and remains technically challenging. In this paper, we review some key enabling technologies that will allow us to overcome the current bottleneck in silicon photonic packaging; while also describing the recent developments in standardisation, including the establishment of PIXAPP as the worlds first open-access PIC packaging and assembly Pilot Line. These developments will allow the community to move from low volume prototype photonic packaged devices to large scale volume manufacturing, where the full commercialisation of PIC technology can be realised.

Original language	English
Title of host publication	Silicon Photonics XIII
Editors	Andrew P. Knights, Graham T. Reed
Publisher	SPIE
ISBN (Electronic)	9781510615595
DOIs	https://doi.org/10.1117/12.2292674
Publication status	Published - 2018
Event	Silicon Photonics XIII 2018 - San Francisco, United States Duration: 29 Jan 2018 → 1 Feb 2018

Publication series

Name	Proceedings of SPIE - The International Society for Optical Engineering
Volume	10537
ISSN (Print)	0277-786X
ISSN (Electronic)	1996-756X

Conference

Conference	Silicon Photonics XIII 2018
Country/Territory	United States
City	San Francisco
Period	29/01/18 → 1/02/18

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

SDG 9 Industry, Innovation, and Infrastructure

Keywords

Photonics
Photonics Packaging

Access to Document

10.1117/12.2292674

Cite this

@inproceedings{998b4ebc0dbb4ef29f629e767871ddf1,

title = "Packaging of silicon photonic devices: From prototypes to production",

abstract = "The challenges associated with the photonic packaging of silicon devices is often underestimated and remains technically challenging. In this paper, we review some key enabling technologies that will allow us to overcome the current bottleneck in silicon photonic packaging; while also describing the recent developments in standardisation, including the establishment of PIXAPP as the worlds first open-access PIC packaging and assembly Pilot Line. These developments will allow the community to move from low volume prototype photonic packaged devices to large scale volume manufacturing, where the full commercialisation of PIC technology can be realised.",

keywords = "Photonics, Photonics Packaging",

author = "Morrissey, \{Padraic E.\} and Kamil Gradkowski and Lee Carroll and Peter O'Brien",

note = "Publisher Copyright: {\textcopyright} COPYRIGHT SPIE. Downloading of the abstract is permitted for personal use only.; Silicon Photonics XIII 2018 ; Conference date: 29-01-2018 Through 01-02-2018",

year = "2018",

doi = "10.1117/12.2292674",

language = "English",

series = "Proceedings of SPIE - The International Society for Optical Engineering",

publisher = "SPIE",

editor = "Knights, \{Andrew P.\} and Reed, \{Graham T.\}",

booktitle = "Silicon Photonics XIII",

address = "United States",

}

Morrissey, PE , Gradkowski, K, Carroll, L & O'Brien, P 2018, Packaging of silicon photonic devices: From prototypes to production. in AP Knights & GT Reed (eds), Silicon Photonics XIII., 105370L, Proceedings of SPIE - The International Society for Optical Engineering, vol. 10537, SPIE, Silicon Photonics XIII 2018, San Francisco, United States, 29/01/18. https://doi.org/10.1117/12.2292674

Packaging of silicon photonic devices: From prototypes to production. / Morrissey, Padraic E.; Gradkowski, Kamil; Carroll, Lee et al.
Silicon Photonics XIII. ed. / Andrew P. Knights; Graham T. Reed. SPIE, 2018. 105370L (Proceedings of SPIE - The International Society for Optical Engineering; Vol. 10537).

Research output: Chapter in Book/Report/Conference proceedings › Conference proceeding › peer-review

TY - GEN

T1 - Packaging of silicon photonic devices

T2 - Silicon Photonics XIII 2018

AU - Morrissey, Padraic E.

AU - Gradkowski, Kamil

AU - Carroll, Lee

AU - O'Brien, Peter

PY - 2018

Y1 - 2018

N2 - The challenges associated with the photonic packaging of silicon devices is often underestimated and remains technically challenging. In this paper, we review some key enabling technologies that will allow us to overcome the current bottleneck in silicon photonic packaging; while also describing the recent developments in standardisation, including the establishment of PIXAPP as the worlds first open-access PIC packaging and assembly Pilot Line. These developments will allow the community to move from low volume prototype photonic packaged devices to large scale volume manufacturing, where the full commercialisation of PIC technology can be realised.

AB - The challenges associated with the photonic packaging of silicon devices is often underestimated and remains technically challenging. In this paper, we review some key enabling technologies that will allow us to overcome the current bottleneck in silicon photonic packaging; while also describing the recent developments in standardisation, including the establishment of PIXAPP as the worlds first open-access PIC packaging and assembly Pilot Line. These developments will allow the community to move from low volume prototype photonic packaged devices to large scale volume manufacturing, where the full commercialisation of PIC technology can be realised.

KW - Photonics

KW - Photonics Packaging

UR - https://www.scopus.com/pages/publications/85047415687

U2 - 10.1117/12.2292674

DO - 10.1117/12.2292674

M3 - Conference proceeding

AN - SCOPUS:85047415687

T3 - Proceedings of SPIE - The International Society for Optical Engineering

BT - Silicon Photonics XIII

A2 - Knights, Andrew P.

A2 - Reed, Graham T.

PB - SPIE

Y2 - 29 January 2018 through 1 February 2018

ER -

Packaging of silicon photonic devices: From prototypes to production

Abstract

Publication series

Conference

UN SDGs

Keywords

Access to Document

Other files and links

Fingerprint

Cite this