@inbook{998b4ebc0dbb4ef29f629e767871ddf1,
title = "Packaging of silicon photonic devices: From prototypes to production",
abstract = "The challenges associated with the photonic packaging of silicon devices is often underestimated and remains technically challenging. In this paper, we review some key enabling technologies that will allow us to overcome the current bottleneck in silicon photonic packaging; while also describing the recent developments in standardisation, including the establishment of PIXAPP as the worlds first open-access PIC packaging and assembly Pilot Line. These developments will allow the community to move from low volume prototype photonic packaged devices to large scale volume manufacturing, where the full commercialisation of PIC technology can be realised.",
keywords = "Photonics, Photonics Packaging",
author = "Morrissey, \{Padraic E.\} and Kamil Gradkowski and Lee Carroll and Peter O'Brien",
note = "Publisher Copyright: {\textcopyright} COPYRIGHT SPIE. Downloading of the abstract is permitted for personal use only.; Silicon Photonics XIII 2018 ; Conference date: 29-01-2018 Through 01-02-2018",
year = "2018",
doi = "10.1117/12.2292674",
language = "English",
series = "Proceedings of SPIE - The International Society for Optical Engineering",
publisher = "SPIE",
editor = "Knights, \{Andrew P.\} and Reed, \{Graham T.\}",
booktitle = "Silicon Photonics XIII",
address = "United States",
}
