@inbook{58d16faaa67f46c3a03a08c4d79db6ac,
title = "Packaging strategies for 3D integration of Photonic and Electronic chips on a Glass substrate",
abstract = "3D printed free-form couplers and inverse tapers are two different vertical integration strategies for coupling light between a PIC and glass interposer. For the free-form coupling scheme, 5×5×0.5 mm3 dummy silicon dies are bonded to a glass substrate using solder bumps via flip-chip bonding. The gap distance between the bonded chips is controlled by the solder height based on various bond pad sizes. An array of 14×14 square gold bond pads on the silicon chip is used with the bond pad length varying from 50 μm to 105 μm in order to maintain a required height. SAC305 solder is jetted onto the bond pads and an optimization of the reflow profile is performed to achieve defect-free, and high-wetting solder bumps. For the inverse taper coupling approach, the PIC is bonded to glass using a UV-curable optical epoxy (n=1.5). The measured vertical distance falls within the 2.8 μm required Z-tolerance for evanescent coupling according to simulation.",
author = "Robert Bernson and Saif Wakeel and Parnika Gupta and Luigi Ranno and Drew Weninger and Anuradha Agarwal and Samuel Serna and Juejun Hu and Kamil Gradkowski and Lionel Kimerling and Peter O'Brien",
note = "Publisher Copyright: {\textcopyright} 2023 IEEE.; 25th Electronics Packaging Technology Conference, EPTC 2023 ; Conference date: 05-12-2023 Through 08-12-2023",
year = "2023",
doi = "10.1109/EPTC59621.2023.10457729",
language = "English",
series = "Proceedings of the 25th Electronics Packaging Technology Conference, EPTC 2023",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "804--808",
editor = "Andrew Tay and Chui, \{King Jien\} and Lim, \{Yeow Kheng\} and Tan, \{Chuan Seng\} and Sunmi Shin",
booktitle = "Proceedings of the 25th Electronics Packaging Technology Conference, EPTC 2023",
address = "United States",
}