Packaging strategies for 3D integration of Photonic and Electronic chips on a Glass substrate

  • Robert Bernson
  • , Saif Wakeel
  • , Parnika Gupta
  • , Luigi Ranno
  • , Drew Weninger
  • , Anuradha Agarwal
  • , Samuel Serna
  • , Juejun Hu
  • , Kamil Gradkowski
  • , Lionel Kimerling
  • , Peter O'Brien

Research output: Chapter in Book/Report/Conference proceedings › Chapter › peer-review

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Engineering

Material Science