Abstract
A method of providing a semiconductor device with a selectively deposited inorganic electrically insulative layer, the device having exposed semiconductor surfaces and electrically conductive metal end terminations, in which the device is saturated in a phosphoric acid solution to form a phosphate layer on the exposed surfaces of the semiconductor but not on the metal end terminations. The device is thereafter plated by a conventional plating process and the plating is provided only on the end terminations.
| Original language | English |
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| Patent number | US6214685 |
| IPC | H01C 7/ 18 A I |
| Priority date | 2/07/98 |
| Publication status | Published - 10 Apr 2001 |