Photonics Packaging for Integrated Photonics, from Research to Pilot Scale Manufacturing

Peter O'Brien

doi:10.23919/MOC52031.2021.9598063

Photonics Packaging for Integrated Photonics, from Research to Pilot Scale Manufacturing

Peter O'Brien

Research output: Chapter in Book/Report/Conference proceedings › Conference proceeding › peer-review

Abstract

An overview of the European Packaging Pilot Line for Photonic Integrated Circuits is presented. The Pilot Line organisation and operation plan based on standardised packaging building blocks, design rules and assembly design kits is reviewed. Examples of packaged integrated photonic modules developed by the Pilot Line is also presented.

Original language	English
Title of host publication	26th Microoptics Conference, MOC 2021
Publisher	Institute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)	9784863487758
DOIs	https://doi.org/10.23919/MOC52031.2021.9598063
Publication status	Published - 2021
Event	26th Microoptics Conference, MOC 2021 - Virtual, Online, Japan Duration: 26 Sep 2021 → 29 Sep 2021

Publication series

Name	26th Microoptics Conference, MOC 2021

Conference

Conference	26th Microoptics Conference, MOC 2021
Country/Territory	Japan
City	Virtual, Online
Period	26/09/21 → 29/09/21

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

SDG 9 Industry, Innovation, and Infrastructure

Access to Document

10.23919/MOC52031.2021.9598063

Cite this

@inproceedings{e1084d3904984d499b11b17241822bd7,

title = "Photonics Packaging for Integrated Photonics, from Research to Pilot Scale Manufacturing",

abstract = "An overview of the European Packaging Pilot Line for Photonic Integrated Circuits is presented. The Pilot Line organisation and operation plan based on standardised packaging building blocks, design rules and assembly design kits is reviewed. Examples of packaged integrated photonic modules developed by the Pilot Line is also presented.",

author = "Peter O'Brien",

note = "Publisher Copyright: {\textcopyright} 2021 Japan Society of Applied Physics.; 26th Microoptics Conference, MOC 2021 ; Conference date: 26-09-2021 Through 29-09-2021",

year = "2021",

doi = "10.23919/MOC52031.2021.9598063",

language = "English",

series = "26th Microoptics Conference, MOC 2021",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

booktitle = "26th Microoptics Conference, MOC 2021",

address = "United States",

}

TY - GEN

T1 - Photonics Packaging for Integrated Photonics, from Research to Pilot Scale Manufacturing

AU - O'Brien, Peter

PY - 2021

Y1 - 2021

N2 - An overview of the European Packaging Pilot Line for Photonic Integrated Circuits is presented. The Pilot Line organisation and operation plan based on standardised packaging building blocks, design rules and assembly design kits is reviewed. Examples of packaged integrated photonic modules developed by the Pilot Line is also presented.

AB - An overview of the European Packaging Pilot Line for Photonic Integrated Circuits is presented. The Pilot Line organisation and operation plan based on standardised packaging building blocks, design rules and assembly design kits is reviewed. Examples of packaged integrated photonic modules developed by the Pilot Line is also presented.

UR - https://www.scopus.com/pages/publications/85123370652

U2 - 10.23919/MOC52031.2021.9598063

DO - 10.23919/MOC52031.2021.9598063

M3 - Conference proceeding

AN - SCOPUS:85123370652

T3 - 26th Microoptics Conference, MOC 2021

BT - 26th Microoptics Conference, MOC 2021

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 26th Microoptics Conference, MOC 2021

Y2 - 26 September 2021 through 29 September 2021

ER -

Photonics Packaging for Integrated Photonics, from Research to Pilot Scale Manufacturing

Abstract

Publication series

Conference

UN SDGs

Access to Document

Other files and links

Fingerprint

Cite this