Abstract
Low pressure chemical vapour deposition (LPCVD) silicon oxynitride and rich nitride films of various composition (from pure SiO2 to pure Si3N4) were deposited by changing the relative gas flow ratio N2O to NH3 and SiH2Cl2 to NH3, respectively. The effects of oxygen on the physical properties of the films were studied using spectroellipsometry and Fourier transform infrared spectroscopy. The deconvolution of the IR spectra was made. The characteristic absorption peak for Si3N4 is at 822 cm-1 (Si-N bonds), and for SiOxNy is around 973 cm-1 (Si-O-Si bond). More oxygen into films decreases the refractive index of the SiOxNy films. Also more silicon in silicon rich nitride increase the refractive index. The refractive index dispersion is studied by single-oscillator Wemple Di Domenico model. The optical gap varies monotonically from 5.43 eV for silicon nitride, to 9 eV for HTO LPCVD silicon dioxide and for the studied silicon oxynitride was found to be around 6 eV.
| Original language | English |
|---|---|
| Pages | 201-204 |
| Number of pages | 4 |
| Publication status | Published - 1998 |
| Externally published | Yes |
| Event | Proceedings of the 1998 International Semiconductor Conference, CAS'98. Part 2 (of 2) - Sinaia, Romania Duration: 6 Oct 1998 → 10 Oct 1998 |
Conference
| Conference | Proceedings of the 1998 International Semiconductor Conference, CAS'98. Part 2 (of 2) |
|---|---|
| City | Sinaia, Romania |
| Period | 6/10/98 → 10/10/98 |
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