@inbook{c1db35a3b61146df934266c9646e4fce,
title = "Planar fiber packaging method for silicon photonic integrated circuits",
abstract = "A novel method for fiber packaging silicon waveguides is presented. The process uses angled fibers and capillary action of UV-cure epoxy. The technique is suited to passive alignment and can be scaled for fiber arrays.",
author = "Bradley Snyder and Peter O'Brien",
year = "2012",
doi = "10.1364/ofc.2012.om2e.5",
language = "English",
isbn = "9781557529381",
series = "Optics InfoBase Conference Papers",
publisher = "Optical Society of America (OSA)",
booktitle = "Optical Fiber Communication Conference, OFC 2012",
note = "Optical Fiber Communication Conference, OFC 2012 ; Conference date: 04-03-2012 Through 08-03-2012",
}