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Pluggable silicon photonic MEMS switch package for data centre

  • University of California at Berkeley
  • Gwangju Institute of Science and Technology

Research output: Chapter in Book/Report/Conference proceedingsConference proceedingpeer-review

Abstract

Consumers' thirst for data has led to the development of various silicon photonic switching devices that are highly scalable while maintaining their relatively compact form factor at the same time. This demands a paradigm shift in the way these devices are being packaged, as optical and electrical ports are involved. In this article, we proposed a pluggable silicon photonic MEMS switch package with passive optical coupling assembly. This approach shifts fibre coupling away from the package, keeping it “purely electrical.” The pluggable concept is separately demonstrated through spring contacted hybrid assembly and pairs of vertically stack surface gratings. Insertion losses are comparable to planar fibre-to-grating coupling, with relatively broadband transmission and assembly tolerance.

Original languageEnglish
Title of host publication2018 IEEE 20th Electronics Packaging Technology Conference, EPTC 2018
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages46-49
Number of pages4
ISBN (Electronic)9781538676684
DOIs
Publication statusPublished - Dec 2018
Event20th IEEE Electronics Packaging Technology Conference, EPTC 2018 - Singapore, Singapore
Duration: 4 Dec 20187 Dec 2018

Publication series

Name2018 IEEE 20th Electronics Packaging Technology Conference, EPTC 2018

Conference

Conference20th IEEE Electronics Packaging Technology Conference, EPTC 2018
Country/TerritorySingapore
CitySingapore
Period4/12/187/12/18

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