TY - GEN
T1 - Pluggable silicon photonic MEMS switch package for data centre
AU - Hwang, How Yuan
AU - Lee, Jun Su
AU - Henriksson, Johannes
AU - Kwon, Kyungmok
AU - Seok, Tae Joon
AU - Wu, Ming C.
AU - O'Brien, Peter
N1 - Publisher Copyright:
© 2018 IEEE.
PY - 2018/12
Y1 - 2018/12
N2 - Consumers' thirst for data has led to the development of various silicon photonic switching devices that are highly scalable while maintaining their relatively compact form factor at the same time. This demands a paradigm shift in the way these devices are being packaged, as optical and electrical ports are involved. In this article, we proposed a pluggable silicon photonic MEMS switch package with passive optical coupling assembly. This approach shifts fibre coupling away from the package, keeping it “purely electrical.” The pluggable concept is separately demonstrated through spring contacted hybrid assembly and pairs of vertically stack surface gratings. Insertion losses are comparable to planar fibre-to-grating coupling, with relatively broadband transmission and assembly tolerance.
AB - Consumers' thirst for data has led to the development of various silicon photonic switching devices that are highly scalable while maintaining their relatively compact form factor at the same time. This demands a paradigm shift in the way these devices are being packaged, as optical and electrical ports are involved. In this article, we proposed a pluggable silicon photonic MEMS switch package with passive optical coupling assembly. This approach shifts fibre coupling away from the package, keeping it “purely electrical.” The pluggable concept is separately demonstrated through spring contacted hybrid assembly and pairs of vertically stack surface gratings. Insertion losses are comparable to planar fibre-to-grating coupling, with relatively broadband transmission and assembly tolerance.
UR - https://www.scopus.com/pages/publications/85091696874
U2 - 10.1109/EPTC.2018.8654270
DO - 10.1109/EPTC.2018.8654270
M3 - Conference proceeding
AN - SCOPUS:85091696874
T3 - 2018 IEEE 20th Electronics Packaging Technology Conference, EPTC 2018
SP - 46
EP - 49
BT - 2018 IEEE 20th Electronics Packaging Technology Conference, EPTC 2018
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 20th IEEE Electronics Packaging Technology Conference, EPTC 2018
Y2 - 4 December 2018 through 7 December 2018
ER -