TY - GEN
T1 - Power inside - Applications and technologies for integrated power in microelectronics
AU - Mathúna, C.
AU - Kulkarni, S.
AU - Pavlovic, Z.
AU - Casey, D.
AU - Rohan, J.
AU - Kelleher, A. M.
AU - Maxwell, G.
AU - O'Brien, J.
AU - McCloskey, P.
N1 - Publisher Copyright:
© 2017 IEEE.
PY - 2018/1/23
Y1 - 2018/1/23
N2 - The emergence of miniaturized and integrated Power Supply on Chip (PwrSoC) and Power Supply in Package (PwrSiP) platforms will be enabled by the application of thin-film, integrated magnetics on silicon. A process flow for, and the design of, a thin-film coupledinductor, switching at 60MHz, is described. Based on the large signal characterization data, measured up to 100MHz, the efficiency of the inductor is calculated to be 91.7% for a power of 0.5W.
AB - The emergence of miniaturized and integrated Power Supply on Chip (PwrSoC) and Power Supply in Package (PwrSiP) platforms will be enabled by the application of thin-film, integrated magnetics on silicon. A process flow for, and the design of, a thin-film coupledinductor, switching at 60MHz, is described. Based on the large signal characterization data, measured up to 100MHz, the efficiency of the inductor is calculated to be 91.7% for a power of 0.5W.
UR - https://www.scopus.com/pages/publications/85045210091
U2 - 10.1109/IEDM.2017.8268318
DO - 10.1109/IEDM.2017.8268318
M3 - Conference proceeding
AN - SCOPUS:85045210091
T3 - Technical Digest - International Electron Devices Meeting, IEDM
SP - 3.3.1-3.3.4
BT - 2017 IEEE International Electron Devices Meeting, IEDM 2017
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 63rd IEEE International Electron Devices Meeting, IEDM 2017
Y2 - 2 December 2017 through 6 December 2017
ER -