Abstract
Atmospheric Pressure Chemical Vapour Deposition (APCVD) films of borophosphosilicate glass with different content of phosphorus and boron was studied as masks for etching in KOH solution. Via the dopant content (B and P) in as-deposited glasses we can control the etch rate and the stress in the layers. The effect of the proposed densification treatment on the BPSG films is investigated using spectroellipsometry and Wemple Di Domenico approximation. The experiments lead to the conclusion that the best solution is a densified thick multiple layers-SiO2-BPSG (4wt. % P, 11wt.%B)-SiO2. The densification treatment used is compatible with the aluminum metalization process.
| Original language | English |
|---|---|
| Pages | 523-526 |
| Number of pages | 4 |
| Publication status | Published - 1999 |
| Externally published | Yes |
| Event | Proceedings of the 1999 International Semiconductor Conference (CAS '99) - Sinaia, Romania Duration: 5 Oct 1999 → 9 Oct 1999 |
Conference
| Conference | Proceedings of the 1999 International Semiconductor Conference (CAS '99) |
|---|---|
| City | Sinaia, Romania |
| Period | 5/10/99 → 9/10/99 |
UN SDGs
This output contributes to the following UN Sustainable Development Goals (SDGs)
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SDG 9 Industry, Innovation, and Infrastructure
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