Problems of N-type doped regions in germanium, their solutions, and how to beat the ITRS roadmap

Research output: Chapter in Book/Report/Conference proceedingsChapterpeer-review

Abstract

In this paper the authors discuss the issues surrounding the formation of ultrashallow n-type junctions in Ge. In general the n-type dopants are relatively difficult to activate and diffuse quickly, leading to high access resistances and limited capability to reduce the device dimensions, respectively. Sheet resistance (Rs) was calculated for n-type box-like profiles in Si and Ge. To achieve ITRS Roadmap targets in Si an active doping concentration of 1.5-2×1020 cm-3 is required, but due to the enhanced electron mobility it is predicted approximately 6×1019 cm-3 is sufficient in Ge.

Original languageEnglish
Title of host publicationSilicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications
PublisherElectrochemical Society Inc.
Pages185-192
Number of pages8
Edition2
ISBN (Electronic)9781607682134
ISBN (Print)9781566778633
DOIs
Publication statusPublished - 2011

Publication series

NameECS Transactions
Number2
Volume35
ISSN (Print)1938-5862
ISSN (Electronic)1938-6737

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